Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6464123 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2002-10-15 |
| 6435400 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2002-08-20 |
| 6390350 | Quick change precisor | Michael B. Ball, Ronald W. Ellis | 2002-05-21 |
| 6334566 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2002-01-01 |
| 6325275 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2001-12-04 |
| 6321970 | Wire bonding machine | Michael B. Ball | 2001-11-27 |
| 6307262 | Condensed memory matrix | Alan G. Wood | 2001-10-23 |
| 6299049 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2001-10-09 |
| RE37396 | Semiconductor wire bonding method | — | 2001-10-02 |
| 6290116 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2001-09-18 |
| 6276594 | Method for positioning the bond head in a wire bonding machine | Michael B. Ball | 2001-08-21 |
| 6253991 | Extended travel wire bonding machine | Michael B. Ball | 2001-07-03 |
| 6253990 | Method for positioning the bond head in a wire bonding machine | Michael B. Ball | 2001-07-03 |
| 6237830 | Quick change precisor | Michael B. Ball, Ronald W. Ellis | 2001-05-29 |
| 6223967 | Extended travel wire bonding machine | Michael B. Ball | 2001-05-01 |
| 6196445 | Method for positioning the bond head in a wire bonding machine | Michael B. Ball | 2001-03-06 |
| 6133630 | Condensed memory matrix | Alan G. Wood | 2000-10-17 |
| 6117693 | System for fabricating and testing assemblies containing wire bonded semiconductor dice | Steve W. Heppler | 2000-09-12 |
| 6071757 | Condensed memory matrix | Alan G. Wood | 2000-06-06 |
| 6068174 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2000-05-30 |
| 6051886 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 2000-04-18 |
| 6047468 | Lead finger clamp assembly and method of stabilizing lead frame elements | Michael B. Ball | 2000-04-11 |
| 6015079 | Positioning device for controlling the position of a workpiece in a horizontal plane | Michael B. Ball | 2000-01-18 |
| 6000599 | Bondhead lead clamp apparatus and method | Michael B. Ball | 1999-12-14 |
| 5977629 | Condensed memory matrix | Alan G. Wood | 1999-11-02 |