Michael B. Ball — 107 Patents at Micron

Michael B. Ball has been granted 107 US patents while listed as an inventor at Micron. The first was granted in 1996 and the most recent in December 2010. Michael B. Ball ranks #12,671 of 4,157,543 US inventors in our database (top 0.30%). Patent records list Michael B. Ball in Boise, ID, US.

Issued Patents All Time

Showing 1–25 of 107 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7846776	Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods	William A. Polinsky	2010-12-07	$4,229,000
7644853	Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux	Chad A. Cobbley, Marjorie L. Waddel	2010-01-12	$6,789,000
7635079	System for locating conductive sphere utilizing screen and hopper of solder balls	Chad A. Cobbley, Marjorie L. Waddel	2009-12-22	$13,803,000
7371612	Method of fabrication of stacked semiconductor devices	—	2008-05-13	$1,487,000
RE40061	Multi-chip stacked devices	—	2008-02-12
7275676	Apparatus for locating conductive spheres utilizing screen and hopper of solder balls	Chad A. Cobbley, Marjorie L. Waddel	2007-10-02	$909,000
7166495	Method of fabricating a multi-die semiconductor package assembly	—	2007-01-23	$2,294,000
7131568	Methods for lead penetrating clamping system	—	2006-11-07	$2,394,000
7105432	Method of locating conductive spheres utilizing screen and hopper of solder balls	Chad A. Cobbley, Marjorie L. Waddel	2006-09-12	$2,031,000
6989285	Method of fabrication of stacked semiconductor devices	—	2006-01-24	$5,383,000
6981629	Apparatus of clamping semiconductor devices using sliding finger supports	—	2006-01-03	$1,955,000
6957760	Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux	Chad A. Cobbley, Marjorie L. Waddel	2005-10-25	$2,371,000
6956294	Apparatus for routing die interconnections using intermediate connection elements secured to the die face	—	2005-10-18	$2,529,000
6949158	Using backgrind wafer tape to enable wafer mounting of bumped wafers	Jose Sanchez	2005-09-27	$1,169,000
6886734	Device and method for clamping and wire-bonding the leads of a lead frame one set at a time	Rich Fogal	2005-05-03	$925,000
6884657	Angularly offset stacked die multichip device and method of manufacture	Rich Fogal	2005-04-26	$1,051,000
6861345	Method of disposing conductive bumps onto a semiconductor device	Chad A. Cobbley	2005-03-01	$1,260,000
6845898	Bondhead lead clamp apparatus	Rich Fogal	2005-01-25	$1,700,000
6844216	Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux	Chad A. Cobbley, Marjorie L. Waddel	2005-01-18	$1,301,000
6837418	Bondhead lead clamp apparatus and method	Rich Fogal	2005-01-04	$1,193,000
6786387	Method for clamping and wire-bonding the leads of a lead frame one set at a time	Rich Fogal	2004-09-07	$988,000
6784023	Method of fabrication of stacked semiconductor devices	—	2004-08-31	$1,044,000
6732902	Lead penetrating clamping system	—	2004-05-11	$2,113,000
6715659	Apparatus for clamping semiconductor devices using sliding finger supports	—	2004-04-06	$2,363,000
6662993	Bondhead lead clamp apparatus	Rich Fogal	2003-12-16	$2,294,000

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Michael B. Ball — 107 Patents

Issued Patents All Time

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