Issued Patents All Time
Showing 25 most recent of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846776 | Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods | William A. Polinsky | 2010-12-07 |
| 7644853 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2010-01-12 |
| 7635079 | System for locating conductive sphere utilizing screen and hopper of solder balls | Chad A. Cobbley, Marjorie L. Waddel | 2009-12-22 |
| 7371612 | Method of fabrication of stacked semiconductor devices | — | 2008-05-13 |
| RE40061 | Multi-chip stacked devices | — | 2008-02-12 |
| 7275676 | Apparatus for locating conductive spheres utilizing screen and hopper of solder balls | Chad A. Cobbley, Marjorie L. Waddel | 2007-10-02 |
| 7166495 | Method of fabricating a multi-die semiconductor package assembly | — | 2007-01-23 |
| 7131568 | Methods for lead penetrating clamping system | — | 2006-11-07 |
| 7105432 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Chad A. Cobbley, Marjorie L. Waddel | 2006-09-12 |
| 6989285 | Method of fabrication of stacked semiconductor devices | — | 2006-01-24 |
| 6981629 | Apparatus of clamping semiconductor devices using sliding finger supports | — | 2006-01-03 |
| 6957760 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2005-10-25 |
| 6956294 | Apparatus for routing die interconnections using intermediate connection elements secured to the die face | — | 2005-10-18 |
| 6949158 | Using backgrind wafer tape to enable wafer mounting of bumped wafers | Jose Sanchez | 2005-09-27 |
| 6886734 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2005-05-03 |
| 6884657 | Angularly offset stacked die multichip device and method of manufacture | Rich Fogal | 2005-04-26 |
| 6861345 | Method of disposing conductive bumps onto a semiconductor device | Chad A. Cobbley | 2005-03-01 |
| 6845898 | Bondhead lead clamp apparatus | Rich Fogal | 2005-01-25 |
| 6844216 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2005-01-18 |
| 6837418 | Bondhead lead clamp apparatus and method | Rich Fogal | 2005-01-04 |
| 6786387 | Method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2004-09-07 |
| 6784023 | Method of fabrication of stacked semiconductor devices | — | 2004-08-31 |
| 6732902 | Lead penetrating clamping system | — | 2004-05-11 |
| 6715659 | Apparatus for clamping semiconductor devices using sliding finger supports | — | 2004-04-06 |
| 6662993 | Bondhead lead clamp apparatus | Rich Fogal | 2003-12-16 |