Issued Patents All Time
Showing 26–50 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6641381 | Wafer dicing blade consisting of multiple layers | — | 2003-11-04 |
| 6637636 | Apparatus of clamping semiconductor devices using sliding finger supports | — | 2003-10-28 |
| 6630372 | Method for routing die interconnections using intermediate connection elements secured to the die face | — | 2003-10-07 |
| 6624059 | Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond | — | 2003-09-23 |
| 6607121 | Quick change precisor | Rich Fogal, Ronald W. Ellis | 2003-08-19 |
| 6604670 | Lead penetrating clamping system | — | 2003-08-12 |
| 6604671 | Bondhead lead clamp apparatus and method | Rich Fogal | 2003-08-12 |
| 6602778 | Apparatus and methods for coupling conductive leads of semiconductor assemblies | Troy A. Manning | 2003-08-05 |
| 6595408 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement | Chad A. Cobbley, Marjorie L. Waddel | 2003-07-22 |
| 6572444 | Apparatus and methods of automated wafer-grinding using grinding surface position monitoring | Chad A. Cobbley | 2003-06-03 |
| 6563205 | Angularly offset and recessed stacked die multichip device and method of manufacture | Rich Fogal | 2003-05-13 |
| 6561177 | Wafer dicing blade consisting of multiple layers | — | 2003-05-13 |
| 6551917 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Chad A. Cobbley, Marjorie L. Waddel | 2003-04-22 |
| 6533159 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Chad A. Cobbley, Marjorie L. Waddel | 2003-03-18 |
| 6494357 | Lead penetrating clamping system | — | 2002-12-17 |
| 6484922 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2002-11-26 |
| 6478211 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-11-12 |
| 6467672 | Methods for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-10-22 |
| 6464123 | Bondhead lead clamp apparatus and method | Rich Fogal | 2002-10-15 |
| 6443822 | Wafer processing apparatus | — | 2002-09-03 |
| 6435400 | Bondhead lead clamp apparatus and method | Rich Fogal | 2002-08-20 |
| 6426564 | Recessed tape and method for forming a BGA assembly | — | 2002-07-30 |
| 6419145 | Lead penetrating clamping system | — | 2002-07-16 |
| 6420256 | Method of improving interconnect of semiconductor devices by using a flattened ball bond | — | 2002-07-16 |
| 6407456 | Multi-chip device utilizing a flip chip and wire bond assembly | — | 2002-06-18 |