Issued Patents All Time
Showing 76–100 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6186392 | Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls | — | 2001-02-13 |
| 6169331 | Apparatus for electrically coupling bond pads of a microelectronic device | Troy A. Manning | 2001-01-02 |
| 6165815 | Method of fabrication of stacked semiconductor devices | — | 2000-12-26 |
| 6097098 | Die interconnections using intermediate connection elements secured to the die face | — | 2000-08-01 |
| 6080264 | Combination of semiconductor interconnect | — | 2000-06-27 |
| 6068174 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2000-05-30 |
| 6051886 | Angularly offset stacked die multichip device and method of manufacture | Rich Fogal | 2000-04-18 |
| 6047877 | Lead penetrating clamping system | — | 2000-04-11 |
| 6047468 | Lead finger clamp assembly and method of stabilizing lead frame elements | Rich Fogal | 2000-04-11 |
| RE36613 | Multi-chip stacked devices | — | 2000-03-14 |
| 6034440 | Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond | — | 2000-03-07 |
| 6015079 | Positioning device for controlling the position of a workpiece in a horizontal plane | Rich Fogal | 2000-01-18 |
| 6000599 | Bondhead lead clamp apparatus and method | Rich Fogal | 1999-12-14 |
| 5976964 | Method of improving interconnect of semiconductor device by utilizing a flattened ball bond | — | 1999-11-02 |
| 5971256 | Quick change precisor | Rich Fogal, Ronald W. Ellis | 1999-10-26 |
| 5963794 | Angularly offset stacked die multichip device and method of manufacture | Rich Fogal | 1999-10-05 |
| 5954842 | Lead finger clamp assembly | Rich Fogal | 1999-09-21 |
| 5952725 | Stacked semiconductor devices | — | 1999-09-14 |
| 5917242 | Combination of semiconductor interconnect | — | 1999-06-29 |
| 5898220 | Multi-chip device and method of fabrication employing leads over and under processes | — | 1999-04-27 |
| 5890644 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 1999-04-06 |
| 5886412 | Angularly offset and recessed stacked die multichip device | Rich Fogal | 1999-03-23 |
| 5874781 | Angularly offset stacked die multichip device and method of manufacture | Rich Fogal | 1999-02-23 |
| 5817530 | Use of conductive lines on the back side of wafers and dice for semiconductor interconnects | — | 1998-10-06 |
| 5813590 | Extended travel wire bonding machine | Rich Fogal | 1998-09-29 |