Issued Patents All Time
Showing 51–75 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6390350 | Quick change precisor | Rich Fogal, Ronald W. Ellis | 2002-05-21 |
| 6380635 | Apparatus and methods for coupling conductive leads of semiconductor assemblies | Troy A. Manning | 2002-04-30 |
| 6337227 | Method of fabrication of stacked semiconductor devices | — | 2002-01-08 |
| 6334566 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2002-01-01 |
| 6325275 | Bondhead lead clamp apparatus and method | Rich Fogal | 2001-12-04 |
| 6321970 | Wire bonding machine | Rich Fogal | 2001-11-27 |
| 6305593 | Lead penetrating clamping system | — | 2001-10-23 |
| 6299049 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Rich Fogal | 2001-10-09 |
| 6299057 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2001-10-09 |
| 6290116 | Bondhead lead clamp apparatus and method | Rich Fogal | 2001-09-18 |
| 6283358 | System for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls | — | 2001-09-04 |
| 6279976 | Wafer handling device having conforming perimeter seal | — | 2001-08-28 |
| 6276594 | Method for positioning the bond head in a wire bonding machine | Rich Fogal | 2001-08-21 |
| 6267287 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2001-07-31 |
| 6268275 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Chad A. Cobbley, Marjorie L. Waddel | 2001-07-31 |
| 6253991 | Extended travel wire bonding machine | Rich Fogal | 2001-07-03 |
| 6253990 | Method for positioning the bond head in a wire bonding machine | Rich Fogal | 2001-07-03 |
| 6237830 | Quick change precisor | Rich Fogal, Ronald W. Ellis | 2001-05-29 |
| 6230569 | Use of a stream of compressed gas to detect semiconductor interconnect problems | — | 2001-05-15 |
| 6227431 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2001-05-08 |
| 6223967 | Extended travel wire bonding machine | Rich Fogal | 2001-05-01 |
| 6206274 | Lead penetrating clamping system | — | 2001-03-27 |
| 6196445 | Method for positioning the bond head in a wire bonding machine | Rich Fogal | 2001-03-06 |
| 6192578 | Method for electrically coupling bond pads of a microelectronic device | Troy A. Manning | 2001-02-27 |
| 6189762 | Apparatus and method of clamping semiconductor devices using sliding finger supports | — | 2001-02-20 |