Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip stacked devices

Multi-chip stacked devices

US Patent RE40061 · Granted Feb 12, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for releasably attaching sacrificial support members to microfeature wor2010
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and2010
System for locating conductive sphere utilizing screen and hopper of solder ball2009
Method of fabrication of stacked semiconductor devices2008
Apparatus for locating conductive spheres utilizing screen and hopper of solder 2007
Method of fabricating a multi-die semiconductor package assembly2007
Methods for lead penetrating clamping system2006
Method of locating conductive spheres utilizing screen and hopper of solder ball2006
Method of fabrication of stacked semiconductor devices2006
Apparatus of clamping semiconductor devices using sliding finger supports2006
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and2005
Apparatus for routing die interconnections using intermediate connection element2005