Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip module and methods

Multi-chip module and methods

US Patent 7619313 · Granted Nov 17, 2009

Estimated economic value: $4,692,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Build-up package for integrated circuit devices, and methods of making same2025
Build-up package for integrated circuit devices, and methods of making same2022
Packaged semiconductor components having substantially rigid support members2020
Packaged semiconductor components having substantially rigid support members2020
Packaged microelectronic devices and methods for manufacturing packaged microele2020
Packaged microelectronic devices and methods for manufacturing packaged microele2020
Build-up package for integrated circuit devices, and methods of making same2020
Computer modules with small thicknesses and associated methods of manufacturing2019
Electronic device assemblies including conductive vias having two or more conduc2019
Packaged semiconductor components having substantially rigid support members and2019
Packaged semiconductor components having substantially rigid support members and2019
System in package (SIP) with dual laminate interposers2019