Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

US Patent 7759785 · Granted Jul 20, 2010

Estimated economic value: $2,641,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assemblies with balanced wires, and associated methods2025
Three dimensional semiconductor trace length matching and associated systems and2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Apparatus including direct-contact heat paths and methods of manufacturing the s2025
Cross stack bridge bonding devices and associated methods2025
Multi-role semiconductor device substrates, semiconductor device assemblies empl2025
Build-up package for integrated circuit devices, and methods of making same2025
Build-up package for integrated circuit devices, and methods of making same2025
Build-up package for integrated circuit devices, and methods of making same2025
Semiconductor assemblies with systems and methods for managing high die stack st2025
Substrates for semiconductor packages, including hybrid substrates for decouplin2025
Through stack bridge bonding devices and associated methods2025