Issued Patents All Time
Showing 126–150 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7067901 | Semiconductor devices including protective layers on active surfaces thereof | Warren M. Farnworth | 2006-06-27 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-06-13 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, James M. Wark, Derek Gochnour | 2006-05-23 |
| 7049700 | Semiconductor test board having laser patterned conductors | David R. Hembree | 2006-05-23 |
| 7033920 | Method for fabricating a silicon carbide interconnect for semiconductor components | Salman Akram | 2006-04-25 |
| 7029949 | Method for fabricating encapsulated semiconductor components having conductive vias | Warren M. Farnworth, Trung T. Doan | 2006-04-18 |
| 7012811 | Method of tuning a multi-path circuit | Tongbi Jiang, John O. Jacobson | 2006-03-14 |
| 7003874 | Methods of bonding solder balls to bond pads on a substrate | Warren M. Farnworth | 2006-02-28 |
| 6998860 | Method for burn-in testing semiconductor dice | Tim J. Corbett, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 2006-02-14 |
| 6998717 | Multi-dice chip scale semiconductor components | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-02-14 |
| 6998344 | Method for fabricating semiconductor components by forming conductive members using solder | Salman Akram, Warren M. Farnworth | 2006-02-14 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, James M. Wark, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more | 2006-02-14 |
| 6983536 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 2006-01-10 |
| 6982564 | Semiconductor test interconnect with variable flexure contacts | Salman Akram | 2006-01-03 |
| 6980014 | Interposer and methods for fabricating same | Salman Akram, Warren M. Farnworth | 2005-12-27 |
| 6979898 | Semiconductor component and a method of fabricating the semiconductor component | Warren M. Farnworth | 2005-12-27 |
| 6975030 | Silicon carbide contact for semiconductor components | Salman Akram | 2005-12-13 |
| 6975037 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Mike Brooks | 2005-12-13 |
| 6964915 | Method of fabricating encapsulated semiconductor components by etching | Warren M. Farnworth, Trung T. Doan | 2005-11-15 |
| 6953995 | Hermetic chip in wafer form | Warren M. Farnworth, Salman Akram | 2005-10-11 |
| 6952744 | Computer including optical interconnect, memory unit, and method of assembling a computer | Warren M. Farnworth | 2005-10-04 |
| 6952054 | Semiconductor package having interconnect with conductive members | Salman Akram, Warren M. Farnworth | 2005-10-04 |
| 6914198 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2005-07-05 |
| 6911355 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Mike Brooks | 2005-06-28 |
| 6911737 | Semiconductor device package and method | Larry D. Kinsman | 2005-06-28 |