Issued Patents All Time
Showing 151–175 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909194 | Electronic assembly having semiconductor component with polymer support member and method of fabrication | Warren M. Farnworth | 2005-06-21 |
| 6909055 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2005-06-21 |
| 6908784 | Method for fabricating encapsulated semiconductor components | Warren M. Farnworth, Trung T. Doan | 2005-06-21 |
| 6903443 | Semiconductor component and interconnect having conductive members and contacts on opposing sides | Warren M. Farnworth, David R. Hembree | 2005-06-07 |
| 6903442 | Semiconductor component having backside pin contacts | Trung T. Doan | 2005-06-07 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6881974 | Probe card for testing microelectronic components | Trung T. Doan, David R. Hembree | 2005-04-19 |
| 6876089 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2005-04-05 |
| 6875640 | Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed | Warren M. Farnworth | 2005-04-05 |
| 6873046 | Chip-scale package and carrier for use therewith | Salman Akram | 2005-03-29 |
| 6861745 | Method and apparatus for conducting heat in a flip-chip assembly | Salman Akram | 2005-03-01 |
| 6857183 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Warren M. Farnworth | 2005-02-22 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2005-02-08 |
| 6847110 | Method and apparatus for conducting heat in a flip-chip assembly | Salman Akram | 2005-01-25 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2005-01-11 |
| 6839961 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Warren M. Farnworth | 2005-01-11 |
| 6833613 | Stacked semiconductor package having laser machined contacts | Salman Akram, Warren M. Farnworth | 2004-12-21 |
| 6828812 | Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections | Warren M. Farnworth, Trung T. Doan, David R. Hembree | 2004-12-07 |
| 6828175 | Semiconductor component with backside contacts and method of fabrication | Trung T. Doan | 2004-12-07 |
| 6815314 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2004-11-09 |
| 6798224 | Method for testing semiconductor wafers | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6797545 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2004-09-28 |
| 6791185 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2004-09-14 |
| 6773957 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Warren M. Farnworth | 2004-08-10 |
| 6773938 | Probe card, e.g., for testing microelectronic components, and methods for making same | Trung T. Doan, David R. Hembree | 2004-08-10 |