| 7589010 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more |
2009-09-15 |
$6,722,000 |
| 7561938 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more |
2009-07-14 |
$3,519,000 |
| 7387119 |
Dicing saw with variable indexing capability |
Salman Akram, Derek Gochnour, David R. Hembree |
2008-06-17 |
$1,834,000 |
| 7155300 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more |
2006-12-26 |
$1,821,000 |
| 7120513 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more |
2006-10-10 |
$1,925,000 |
| 6998334 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more |
2006-02-14 |
$2,198,000 |
| 6932077 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus |
Salman Akram, Derek Gochnour, David R. Hembree |
2005-08-23 |
$1,384,000 |
| 6897571 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2005-05-24 |
$1,184,000 |
| 6851597 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood |
2005-02-08 |
$1,358,000 |
| 6691696 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2004-02-17 |
$2,708,000 |
| 6687990 |
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby |
Salman Akram, Derek Gochnour, David R. Hembree |
2004-02-10 |
$2,630,000 |
| 6631662 |
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2003-10-14 |
$4,453,000 |
| 6619532 |
Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood |
2003-09-16 |
$4,026,000 |
| 6578458 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2003-06-17 |
$4,055,000 |
| 6553276 |
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more |
2003-04-22 |
$2,218,000 |
| 6493934 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2002-12-17 |
|
| 6459105 |
Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2002-10-01 |
$3,166,000 |
| 6427676 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2002-08-06 |
$3,513,000 |
| 6427899 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood |
2002-08-06 |
$3,513,000 |
| 6423616 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2002-07-23 |
$3,822,000 |
| 6419143 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood |
2002-07-16 |
$4,820,000 |
| 6417685 |
Test system having alignment member for aligning semiconductor components |
Salman Akram, Warren M. Farnworth, David R. Hembree |
2002-07-09 |
$4,358,000 |
| 6401580 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
Salman Akram, Derek Gochnour, David R. Hembree |
2002-06-11 |
$5,486,000 |
| 6400174 |
Test system having alignment member for aligning semiconductor components |
Salman Akram, Warren M. Farnworth, David R. Hembree |
2002-06-04 |
$5,091,000 |
| 6363295 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more |
2002-03-26 |
$7,434,000 |
