Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more | 2009-09-15 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2009-07-14 |
| 7387119 | Dicing saw with variable indexing capability | Salman Akram, Derek Gochnour, David R. Hembree | 2008-06-17 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2006-12-26 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2006-10-10 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more | 2006-02-14 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Salman Akram, Derek Gochnour, David R. Hembree | 2005-08-23 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2005-05-24 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2005-02-08 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2004-02-17 |
| 6687990 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Salman Akram, Derek Gochnour, David R. Hembree | 2004-02-10 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2003-10-14 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2003-06-17 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2003-04-22 |
| 6493934 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-12-17 |
| 6459105 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-10-01 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-08-06 |
| 6427676 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-08-06 |
| 6423616 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-07-23 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2002-07-09 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-06-11 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2002-06-04 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2002-03-26 |