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Michael E. Hess — 36 Patents

Micron: 35 patents #540 of 6,374Top 9%

Kuna, ID: #6 of 87 inventorsTop 7%

Idaho: #401 of 8,810 inventorsTop 5%

Overall (All Time): #92,222 of 4,157,543Top 3%

36 Patents All Time

Michael E. Hess has been granted 36 US patents while listed as an inventor at Micron. The first was granted in 1999 and the most recent in September 2009. Michael E. Hess ranks #92,222 of 4,157,543 US inventors in our database (top 2.2%). Patent records list Michael E. Hess in Kuna, ID, US.

Patents per Year

Issued Patents All Time

Showing 26–36 of 36 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6296171	Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems	David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood	2001-10-02	$6,544,000
6285203	Test system having alignment member for aligning semiconductor components	Salman Akram, Warren M. Farnworth, David R. Hembree	2001-09-04	$11,707,000
6279563	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2001-08-28	$10,002,000
6255196	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2001-07-03	$10,281,000
6250192	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2001-06-26	$18,844,000
6196096	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2001-03-06	$20,369,000
6155247	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2000-12-05	$14,390,000
6119675	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	2000-09-19	$14,959,000
6045026	Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems	David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood	2000-04-04	$45,605,000
6006739	Method for sawing wafers employing multiple indexing techniques for multiple die dimensions	Salman Akram, Derek Gochnour, David R. Hembree	1999-12-28	$14,966,000
5907492	Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs	Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more	1999-05-25	$9,486,000