Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus

US Patent 6932077 · Granted Aug 23, 2005

Estimated economic value: $1,384,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices with redistribution structures configured for switchable r2025
Semiconductor device assembly with die support structures2024
Semiconductor devices with redistribution structures configured for switchable r2023
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023
Method of bonding a semiconductor device to a support substrate2023
Elevated pocket pixels, imaging devices and systems including the same and metho2023
Image sensor packages and related methods2022
Apparatuses and methods for internal heat spreading for packaged semiconductor d2022
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2022
Semiconductor devices with redistribution structures configured for switchable r2021
Chip scale light emitting device package with dome2021
Elevated pocket pixels, imaging devices and systems including the same and metho2021