Issued Patents All Time
Showing 201–225 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600171 | Semiconductor component and system for fabricating contacts on semiconductor components | Warren M. Farnworth, Douglas Kelly | 2003-07-29 |
| 6597066 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2003-07-22 |
| 6583635 | Semiconductor die test carrier having conductive elastomeric interposer | David R. Hembree | 2003-06-24 |
| 6576495 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Tongbi Jiang, Jason L. Fuller | 2003-06-10 |
| 6570251 | Under bump metalization pad and solder bump connections | Salman Akram | 2003-05-27 |
| 6563215 | Silicon carbide interconnect for semiconductor components and method of fabrication | Salman Akram | 2003-05-13 |
| 6562637 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2003-05-13 |
| 6555399 | Double-packaged multichip semiconductor module | Eugene H. Cloud, Larry D. Kinsman | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2003-04-22 |
| 6548392 | Methods of a high density flip chip memory arrays | Salman Akram, Warren M. Farnworth | 2003-04-15 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Derek Gochnour, John O. Jacobson +2 more | 2003-04-08 |
| 6541303 | Method for conducting heat in a flip-chip assembly | Salman Akram | 2003-04-01 |
| 6538334 | High density flip chip memory arrays | Salman Akram, Warren M. Farnworth | 2003-03-25 |
| 6535393 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2003-03-18 |
| 6535012 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2003-03-18 |
| 6531345 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2003-03-11 |
| 6529027 | Interposer and methods for fabricating same | Salman Akram, Warren M. Farnworth | 2003-03-04 |
| 6521995 | Wafer-level package | Salman Akram | 2003-02-18 |
| 6519658 | Memory unit and method of assembling a computer | Warren M. Farnworth | 2003-02-11 |
| 6518094 | Center bond flip-chip semiconductor device and method of making it | Tongbi Jiang | 2003-02-11 |
| 6509647 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2003-01-21 |
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Mike Brooks | 2002-12-31 |
| 6498503 | Semiconductor test interconnect with variable flexure contacts | Salman Akram | 2002-12-24 |
| 6492738 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2002-12-10 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |