Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7485971 | Electronic device package | Frank Hall, Tongbi Jiang | 2009-02-03 |
| 7198693 | Microelectronic device having a plurality of stacked dies and methods for manufacturing such microelectronic assemblies | Shaun D Compton | 2007-04-03 |
| 7084515 | Electronic device package | Frank Hall, Tongbi Jiang | 2006-08-01 |
| 6969914 | Electronic device package | Frank Hall, Tongbi Jiang | 2005-11-29 |
| 6661104 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Tongbi Jiang, Alan G. Wood | 2003-12-09 |
| 6576495 | Microelectronic assembly with pre-disposed fill material and associated method of manufacture | Tongbi Jiang, Alan G. Wood | 2003-06-10 |