Frank Hall — 20 Patents at Micron

Frank Hall has been granted 20 US patents while listed as an inventor at Micron. The first was granted in 1991 and the most recent in January 2012. Frank Hall ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Frank Hall in Houston, TX, US.

Patents per Year

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Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8093730	Underfilled semiconductor die assemblies and methods of forming the same	Cary J. Baerlocher	2012-01-10	$3,429,000
7993977	Method of forming molded standoff structures on integrated circuit devices	James L. Voelz	2011-08-09	$2,316,000
7851907	Semiconductor integrated circuit package having electrically disconnected solder balls for mounting	Cary J. Baerlocher	2010-12-14	$3,930,000
7642643	Apparatus for molding a semiconductor die package with enhanced thermal conductivity	Todd O. Bolken	2010-01-05	$5,811,000
7498606	Microelectronic imaging units and methods of manufacturing microelectronic imaging units	Bret K. Street, James M. Derderian	2009-03-03	$1,946,000
7485971	Electronic device package	Jason L. Fuller, Tongbi Jiang	2009-02-03	$2,699,000
7468559	Semiconductor integrated circuit package having electrically disconnected solder balls for mounting	Cary J. Baerlocher	2008-12-23	$4,004,000
7416913	Methods of manufacturing microelectronic imaging units with discrete standoffs	William Reeder, Bret K. Street, James M. Derderian	2008-08-26	$1,395,000
7417294	Microelectronic imaging units and methods of manufacturing microelectronic imaging units	William Reeder, Bret K. Street, James M. Derderian	2008-08-26	$1,395,000
7364934	Microelectronic imaging units and methods of manufacturing microelectronic imaging units	Bret K. Street, James M. Derderian	2008-04-29	$1,653,000
7342319	Semiconductor integrated circuit package having electrically disconnected solder balls for mounting	Cary J. Baerlocher	2008-03-11	$3,016,000
7276802	Semiconductor integrated circuit package having electrically disconnected solder balls for mounting	Cary J. Baerlocher	2007-10-02	$909,000
7268067	Semiconductor integrated circuit package having electrically disconnected solder balls for mounting	Cary J. Baerlocher	2007-09-11	$1,295,000
7262074	Methods of fabricating underfilled, encapsulated semiconductor die assemblies	Cary J. Baerlocher	2007-08-28	$1,732,000
7116000	Underfilled, encapsulated semiconductor die assemblies and methods of fabrication	Cary J. Baerlocher	2006-10-03	$1,273,000
7084515	Electronic device package	Jason L. Fuller, Tongbi Jiang	2006-08-01	$2,483,000
6987058	Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material	—	2006-01-17	$3,508,000
6969914	Electronic device package	Jason L. Fuller, Tongbi Jiang	2005-11-29	$2,769,000
6835592	Methods for molding a semiconductor die package with enhanced thermal conductivity	Todd O. Bolken	2004-12-28	$1,491,000
5072795	Pressure compensator for drill bit lubrication system	Steve R. Delgado, Robert J. Kotch	1991-12-17

Frank Hall — 20 Patents

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Issued Patents All Time

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