Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7767557 | Chilled wafer dicing | — | 2010-08-03 |
| 7416913 | Methods of manufacturing microelectronic imaging units with discrete standoffs | Frank Hall, Bret K. Street, James M. Derderian | 2008-08-26 |
| 7417294 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units | Frank Hall, Bret K. Street, James M. Derderian | 2008-08-26 |
| 7229905 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, Leonard E. Mess | 2007-06-12 |
| 7138724 | Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask | Ford B. Grigg | 2006-11-21 |
| 7125748 | Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask | Ford B. Grigg | 2006-10-24 |
| 6984545 | Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask | Ford B. Grigg | 2006-01-10 |
| 6869869 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, Leonard E. Mess | 2005-03-22 |
| 6577004 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6577019 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, Leonard E. Mess | 2003-06-10 |