| 8049342 |
Semiconductor device and method of fabrication thereof |
Jerry M. Brooks, David J. Corisis |
2011-11-01 |
|
| 7998792 |
Semiconductor device assemblies, electronic devices including the same and assembly methods |
Jerry M. Brooks, David J. Corisis |
2011-08-16 |
|
| 7999378 |
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement |
Jerry M. Brooks, David J. Corisis |
2011-08-16 |
|
| 7829991 |
Stackable ceramic FBGA for high thermal applications |
Walter L. Moden, David J. Corisis, Larry D. Kinsman |
2010-11-09 |
$3,205,000 |
| 7704794 |
Method of forming a semiconductor device |
Jerry M. Brooks, David J. Corisis |
2010-04-27 |
$5,377,000 |
| 7408255 |
Assembly for stacked BGA packages |
David J. Corisis, Walter L. Moden, Larry D. Kinsman |
2008-08-05 |
$1,916,000 |
| 7400032 |
Module assembly for stacked BGA packages |
David J. Corisis, Walter L. Moden, Larry D. Kinsman |
2008-07-15 |
$1,858,000 |
| 7396702 |
Module assembly and method for stacked BGA packages |
David J. Corisis, Walter L. Moden, Larry D. Kinsman |
2008-07-08 |
$1,892,000 |
| 7375419 |
Stacked mass storage flash memory package |
Jerry M. Brooks, David J. Corisis |
2008-05-20 |
$2,269,000 |
| 7285442 |
Stackable ceramic FBGA for high thermal applications |
Walter L. Moden, David J. Corisis, Larry D. Kinsman |
2007-10-23 |
$1,940,000 |
| 7279797 |
Module assembly and method for stacked BGA packages |
David J. Corisis, Walter L. Moden, Larry D. Kinsman |
2007-10-09 |
$1,129,000 |
| 7262506 |
Stacked mass storage flash memory package |
Jerry M. Brooks, David J. Corisis |
2007-08-28 |
$1,732,000 |
| 7229905 |
Alignment and orientation features for a semiconductor package |
Stuart L. Roberts, William Reeder |
2007-06-12 |
$2,469,000 |
| 7166252 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Derek Gochnour |
2007-01-23 |
$2,294,000 |
| 6900528 |
Stacked mass storage flash memory package |
Jerry M. Brooks, David J. Corisis |
2005-05-31 |
$1,015,000 |
| 6869869 |
Alignment and orientation features for a semiconductor package |
Stuart L. Roberts, William Reeder |
2005-03-22 |
$1,900,000 |
| 6864700 |
System for electronically coupling a device to an electrical apparatus |
— |
2005-03-08 |
$1,367,000 |
| 6858926 |
Stackable ceramic FBGA for high thermal applications |
Walter L. Moden, David J. Corisis, Larry D. Kinsman |
2005-02-22 |
$1,354,000 |
| 6838768 |
Module assembly for stacked BGA packages |
David J. Corisis, Walter L. Moden, Larry D. Kinsman |
2005-01-04 |
|
| 6830719 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Derek Gochnour |
2004-12-14 |
$1,542,000 |
| 6815261 |
Encapsulation method in a molding machine for an electronic device |
— |
2004-11-09 |
$1,311,000 |
| 6777965 |
Interposer for electrically coupling a semiconductive device to an electrical apparatus |
— |
2004-08-17 |
$1,525,000 |
| 6764549 |
Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Derek Gochnour |
2004-07-20 |
$2,873,000 |
| 6760224 |
Heat sink with alignment and retaining features |
Walter L. Moden, David J. Corisis, Larry D. Kinsman |
2004-07-06 |
$2,228,000 |
| 6690188 |
Method of testing a semiconductor device |
— |
2004-02-10 |
$2,630,000 |
