Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650007 | Stackable ceramic fbga for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2003-11-18 |
| 6592670 | Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2003-07-15 |
| 6577019 | Alignment and orientation features for a semiconductor package | Stuart L. Roberts, William Reeder | 2003-06-10 |
| 6563217 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-05-13 |
| 6558966 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-05-06 |
| 6527999 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2003-03-04 |
| 6525943 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2003-02-25 |
| 6512302 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2003-01-28 |
| 6472252 | Methods for ball grid array (BGA) encapsulation mold | — | 2002-10-29 |
| 6414391 | Module assembly for stacked BGA packages with a common bus bar in the assembly | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2002-07-02 |
| 6380631 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2002-04-30 |
| 6335221 | Ball grid array (BGA) encapsulation mold | — | 2002-01-01 |
| 6297960 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2001-10-02 |
| 6297548 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Larry D. Kinsman | 2001-10-02 |
| 6294839 | Apparatus and methods of packaging and testing die | David J. Corisis, Walter L. Moden, Larry D. Kinsman | 2001-09-25 |
| 6291265 | Method of manufacturing an interposer | — | 2001-09-18 |
| 6224936 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Derek Gochnour | 2001-05-01 |
| 6164946 | Ball grid array (BGA) encapsulation mold | — | 2000-12-26 |
| 6007317 | Ball grid array (BGA) encapsulation mold | — | 1999-12-28 |
| 5923959 | Ball grid array (BGA) encapsulation mold | — | 1999-07-13 |