| 8554166 |
Methods of operating electronic devices, and methods of providing electronic devices |
— |
2013-10-08 |
|
| 8036629 |
Methods of operating electronic devices, and methods of providing electronic devices |
— |
2011-10-11 |
|
| 7951646 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more |
2011-05-31 |
|
| 7778621 |
Methods of operating electronic devices, and methods of providing electronic devices |
— |
2010-08-17 |
|
| 7593708 |
Methods of operating electronic devices, and methods of providing electronic devices |
— |
2009-09-22 |
|
| 7216425 |
Method of forming a non-continuous conductive layer for laminated substrates |
— |
2007-05-15 |
$2,539,000 |
| 7107019 |
Methods of operating microelectronic devices, and methods of providing microelectronic devices |
— |
2006-09-12 |
$2,031,000 |
| 7094046 |
Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging |
— |
2006-08-22 |
$2,069,000 |
| 6998714 |
Selectively coating bond pads |
— |
2006-02-14 |
$2,198,000 |
| 6914326 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more |
2005-07-05 |
$1,616,000 |
| 6899534 |
Mold assembly for a package stack via bottom-leaded plastic (blp) packaging |
— |
2005-05-31 |
$1,015,000 |
| 6756606 |
Apparatus and method for marking defective sections of laminate substrates |
— |
2004-06-29 |
$1,990,000 |
| 6729024 |
Method of forming a non-continuous conductive layer for laminated substrates |
— |
2004-05-04 |
$2,050,000 |
| 6727437 |
Non-continuous conductive layer for laminated substrates |
— |
2004-04-27 |
$2,268,000 |
| 6718163 |
Methods of operating microelectronic devices, and methods of providing microelectronic devices |
— |
2004-04-06 |
$2,363,000 |
| 6658727 |
Method for assembling die package |
— |
2003-12-09 |
$2,872,000 |
| 6660558 |
Semiconductor package with molded flash |
Todd O. Bolken, David L. Peters, Chad A. Cobbley |
2003-12-09 |
$2,872,000 |
| 6657288 |
Compression layer on the lead frame to reduce stress defects |
— |
2003-12-02 |
$2,846,000 |
| 6577004 |
Solder ball landpad design to improve laminate performance |
Brad D. Rumsey, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more |
2003-06-10 |
$2,834,000 |
| 6553658 |
Assembling a stacked die package |
— |
2003-04-29 |
$2,096,000 |
| 6542720 |
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices |
— |
2003-04-01 |
$2,471,000 |
| 6537051 |
Encapsulation mold with a castellated inner surface |
— |
2003-03-25 |
$1,989,000 |
| 6521980 |
Controlling packaging encapsulant leakage |
Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more |
2003-02-18 |
$1,955,000 |
| 6499213 |
Assembling a stacked die package |
— |
2002-12-31 |
$3,585,000 |
| 6486539 |
Compression layer on the leadframe to reduce stress defects |
— |
2002-11-26 |
$5,696,000 |
