Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8554166 | Methods of operating electronic devices, and methods of providing electronic devices | — | 2013-10-08 |
| 8036629 | Methods of operating electronic devices, and methods of providing electronic devices | — | 2011-10-11 |
| 7951646 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2011-05-31 |
| 7778621 | Methods of operating electronic devices, and methods of providing electronic devices | — | 2010-08-17 |
| 7593708 | Methods of operating electronic devices, and methods of providing electronic devices | — | 2009-09-22 |
| 7216425 | Method of forming a non-continuous conductive layer for laminated substrates | — | 2007-05-15 |
| 7107019 | Methods of operating microelectronic devices, and methods of providing microelectronic devices | — | 2006-09-12 |
| 7094046 | Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging | — | 2006-08-22 |
| 6998714 | Selectively coating bond pads | — | 2006-02-14 |
| 6914326 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2005-07-05 |
| 6899534 | Mold assembly for a package stack via bottom-leaded plastic (blp) packaging | — | 2005-05-31 |
| 6756606 | Apparatus and method for marking defective sections of laminate substrates | — | 2004-06-29 |
| 6729024 | Method of forming a non-continuous conductive layer for laminated substrates | — | 2004-05-04 |
| 6727437 | Non-continuous conductive layer for laminated substrates | — | 2004-04-27 |
| 6718163 | Methods of operating microelectronic devices, and methods of providing microelectronic devices | — | 2004-04-06 |
| 6658727 | Method for assembling die package | — | 2003-12-09 |
| 6660558 | Semiconductor package with molded flash | Todd O. Bolken, David L. Peters, Chad A. Cobbley | 2003-12-09 |
| 6657288 | Compression layer on the lead frame to reduce stress defects | — | 2003-12-02 |
| 6577004 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2003-06-10 |
| 6553658 | Assembling a stacked die package | — | 2003-04-29 |
| 6542720 | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices | — | 2003-04-01 |
| 6537051 | Encapsulation mold with a castellated inner surface | — | 2003-03-25 |
| 6521980 | Controlling packaging encapsulant leakage | Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2003-02-18 |
| 6499213 | Assembling a stacked die package | — | 2002-12-31 |
| 6486539 | Compression layer on the leadframe to reduce stress defects | — | 2002-11-26 |