Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder ball landpad design to improve laminate performance

Solder ball landpad design to improve laminate performance

US Patent 6577004 · Granted Jun 10, 2003

Estimated economic value: $2,834,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrates with continuous slot vias2025
Apparatuses and systems having ball grid arrays and associated microelectronic d2024
Methods of operating electronic devices, and methods of providing electronic dev2013
Methods of operating electronic devices, and methods of providing electronic dev2011
Solder ball landpad design to improve laminate performance2011
Solder ball landpad design to improve laminate performance2011
Solder ball landpad design to improve laminate performance2011
Solder ball landpad design to improve laminate performance2011
Solder ball landpad design to improve laminate performance2011
Solder ball landpad design to improve laminate performance2011
Methods of operating electronic devices, and methods of providing electronic dev2010
Chilled wafer dicing2010