Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chilled wafer dicing

Chilled wafer dicing

US Patent 7767557 · Granted Aug 3, 2010

Estimated economic value: $2,326,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of manufacturing microelectronic imaging units with discrete standoffs2008
Microelectronic imaging units and methods of manufacturing microelectronic imagi2008
Alignment and orientation features for a semiconductor package2007
Thick solder mask for confining encapsulant material over selected locations of 2006
Methods of encapsulating selected locations of a semiconductor die assembly usin2006
Methods of encapsulating selected locations of a semiconductor die assembly usin2006
Alignment and orientation features for a semiconductor package2005
Solder ball landpad design to improve laminate performance2003
Alignment and orientation features for a semiconductor package2003