Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7951646 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Dana A. Stoddard +1 more | 2011-05-31 |
| 7268013 | Method of fabricating a semiconductor die package having improved inductance characteristics | Jerry M. Brooks | 2007-09-11 |
| 6989121 | Method for encasing plastic array packages | — | 2006-01-24 |
| 6982486 | Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same | Jerry M. Brooks | 2006-01-03 |
| 6914326 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Dana A. Stoddard +1 more | 2005-07-05 |
| 6893244 | Apparatus for encasing array packages | — | 2005-05-17 |
| 6740971 | Cavity ball grid array apparatus having improved inductance characteristics | Jerry M. Brooks | 2004-05-25 |
| 6626656 | Apparatus for encasing array packages | — | 2003-09-30 |
| 6616880 | Method for encasing array packages | — | 2003-09-09 |
| 6577004 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, William Reeder, Stephen F. Moxham, Dana A. Stoddard +1 more | 2003-06-10 |
| 6332766 | Apparatus for encasing array packages | — | 2001-12-25 |
| 6326244 | Method of making a cavity ball grid array apparatus | Jerry M. Brooks | 2001-12-04 |
| 6287503 | Method for encasing array packages | — | 2001-09-11 |
| 6247629 | Wire bond monitoring system for layered packages | John O. Jacobson, Derek Gochnour | 2001-06-19 |
| 6117382 | Method for encasing array packages | — | 2000-09-12 |
| 6085962 | Wire bond monitoring system for layered packages | John O. Jacobson, Derek Gochnour | 2000-07-11 |
| 6084297 | Cavity ball grid array apparatus | Jerry M. Brooks | 2000-07-04 |
| 6057597 | Semiconductor package with pre-fabricated cover | Warren M. Farnworth, David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson +1 more | 2000-05-02 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson +1 more | 1999-04-13 |