WR

Willam J. Reeder

RR Round Rock Research: 1 patents #177 of 239Top 75%
Micron: 1 patents #4,761 of 6,345Top 80%
📍 Boise, ID: #1,893 of 3,546 inventorsTop 55%
🗺 Idaho: #3,799 of 8,810 inventorsTop 45%
Overall (All Time): #2,107,508 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7951646 Solder ball landpad design to improve laminate performance Brad D. Rumsey, Patrick W. Tandy, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more 2011-05-31
6914326 Solder ball landpad design to improve laminate performance Brad D. Rumsey, Patrick W. Tandy, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more 2005-07-05