Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429385 | Non-continuous conductive layer for laminated substrates | — | 2002-08-06 |
| 6404216 | Test contact | — | 2002-06-11 |
| 6403457 | Selectively coating bond pads | — | 2002-06-11 |
| 6395579 | Controlling packaging encapsulant leakage | Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2002-05-28 |
| 6392289 | Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same | — | 2002-05-21 |
| 6331453 | Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities | Todd O. Bolken, David L. Peters, Chad A. Cobbley | 2001-12-18 |
| 6265660 | Package stack via bottom leaded plastic (BLP) packaging | — | 2001-07-24 |
| 6221695 | Method for fabricating a compression layer on the dead frame to reduce stress defects | — | 2001-04-24 |
| 6213747 | Package stack via bottom leaded plastic (BLP) packaging | — | 2001-04-10 |
| 6212767 | Assembling a stacked die package | — | 2001-04-10 |
| 6210992 | Controlling packaging encapsulant leakage | Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2001-04-03 |
| 6188021 | Package stack via bottom leaded plastic (BLP) packaging | — | 2001-02-13 |
| 6166328 | Package stack via bottom leaded plastic (BLP) packaging | — | 2000-12-26 |
| 6146919 | Package stack via bottom leaded plastic (BLP) packaging | — | 2000-11-14 |
| 6140695 | Compression layer on the leadframe to reduce stress defects | — | 2000-10-31 |
| 5986209 | Package stack via bottom leaded plastic (BLP) packaging | — | 1999-11-16 |
| 5923081 | Compression layer on the leadframe to reduce stress defects | — | 1999-07-13 |