Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

US Patent 7642643 · Granted Jan 5, 2010

Estimated economic value: $5,811,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assembly with through-package interconnect and associated s2022
Semiconductor device assembly with through-package interconnect and associated s2020
Method of assembly semiconductor device with through-package interconnect2018
Techniques for packaging multiple device components2017
Semiconductor device assembly with package interconnect extending into overlying2016
Semiconductor device with molded casing and package interconnect extending there2014
Methods of packaging imager devices and optics modules, and resulting assemblies2014
Techniques for packaging multiple device components2014
Methods of fabrication of package assemblies for optically interactive electroni2014
Electronic devices2013
Methods of fabrication of package assemblies for optically interactive electroni2013
Techniques for packaging multiple device components2012