Issued Patents All Time
Showing 251–275 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6351034 | Clip chip carrier | Warren M. Farnworth, Derek Gochnour | 2002-02-26 |
| 6342789 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2002-01-29 |
| 6340894 | Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect | Warren M. Farnworth, Trung T. Doan, David R. Hembree | 2002-01-22 |
| 6329712 | High density flip chip memory arrays | Salman Akram, Warren M. Farnworth | 2001-12-11 |
| 6326245 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2001-12-04 |
| 6319354 | System and method for dicing semiconductor components | Warren M. Farnworth | 2001-11-20 |
| 6320397 | Molded plastic carrier for testing semiconductor dice | Warren M. Farnworth, David R. Hembree | 2001-11-20 |
| 6313651 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Derek Gochnour, Salman Akram | 2001-11-06 |
| 6310484 | Semiconductor test interconnect with variable flexure contacts | Salman Akram | 2001-10-30 |
| 6307262 | Condensed memory matrix | Rich Fogal | 2001-10-23 |
| 6296171 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2001-10-02 |
| 6294837 | Semiconductor interconnect having laser machined contacts | Salman Akram, Warren M. Farnworth | 2001-09-25 |
| 6294824 | Bonding support for leads-over-chip process | Mike Brooks | 2001-09-25 |
| 6287942 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2001-09-11 |
| 6275052 | Probe card and testing method for semiconductor wafers | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2001-08-14 |
| 6271056 | Stacked semiconductor package and method of fabrication | Warren M. Farnworth, Mike Brooks | 2001-08-07 |
| 6265245 | Compliant interconnect for testing a semiconductor die | Warren M. Farnworth, Salman Akram | 2001-07-24 |
| 6258609 | Method and system for making known good semiconductor dice | Warren M. Farnworth | 2001-07-10 |
| 6255833 | Method for testing semiconductor dice and chip scale packages | Salman Akram, David R. Hembree, Warren M. Farnworth | 2001-07-03 |
| 6235554 | Method for fabricating stackable chip scale semiconductor package | Salman Akram, Warren M. Farnworth | 2001-05-22 |
| 6228687 | Wafer-level package and methods of fabricating | Salman Akram | 2001-05-08 |
| 6222379 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, David R. Hembree, Salman Akram | 2001-04-24 |
| 6219908 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 2001-04-24 |
| 6215322 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, David R. Hembree, Salman Akram | 2001-04-10 |
| 6210984 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2001-04-03 |