Issued Patents All Time
Showing 276–300 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6210993 | High density semiconductor package and method of fabrication | Warren M. Farnworth, Salman Akram, Mike Brooks, Eugene H. Cloud | 2001-04-03 |
| 6208157 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Derek Gochnour, John O. Jacobson | 2001-03-27 |
| 6188232 | Temporary package, system, and method for testing semiconductor dice and chip scale packages | Salman Akram, Warren M. Farnworth | 2001-02-13 |
| 6180504 | Method for fabricating a semiconductor component with external polymer support layer | Warren M. Farnworth | 2001-01-30 |
| 6175242 | Method for forming coaxial silicon interconnects | Salman Akram, David R. Hembree | 2001-01-16 |
| 6169329 | Semiconductor devices having interconnections using standardized bonding locations and methods of designing | Warren M. Farnworth | 2001-01-02 |
| 6150828 | Method and apparatus for automatically positioning electronic dice with component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2000-11-21 |
| 6150717 | Direct die contact (DDC) semiconductor package | Warren M. Farnworth, Ford B. Grigg, Salman Akram | 2000-11-21 |
| 6136137 | System and method for dicing semiconductor components | Warren M. Farnworth | 2000-10-24 |
| 6133638 | Die-to-insert permanent connection and method of forming | Warren M. Farnworth | 2000-10-17 |
| 6133630 | Condensed memory matrix | Rich Fogal | 2000-10-17 |
| 6118179 | Semiconductor component with external contact polymer support member and method of fabrication | Warren M. Farnworth | 2000-09-12 |
| 6114240 | Method for fabricating semiconductor components using focused laser beam | Salman Akram, Warren M. Farnworth | 2000-09-05 |
| 6107122 | Direct die contact (DDC) semiconductor package | Warren M. Farnworth, Ford B. Grigg, Salman Akram | 2000-08-22 |
| 6107119 | Method for fabricating semiconductor components | Warren M. Farnworth | 2000-08-22 |
| 6107109 | Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate | Salman Akram, Warren M. Farnworth | 2000-08-22 |
| 6100175 | Method and apparatus for aligning and attaching balls to a substrate | Salman Akram, Mike Hess, David R. Hembree | 2000-08-08 |
| 6097087 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Mike Brooks | 2000-08-01 |
| 6093933 | Method and apparatus for fabricating electronic device | Warren M. Farnworth, Kevin G. Duesman | 2000-07-25 |
| 6094058 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Warren M. Farnworth, Salman Akram | 2000-07-25 |
| 6091252 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2000-07-18 |
| 6091254 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2000-07-18 |
| 6091250 | Discrete die burn-in for nonpackaged die | Tim J. Corbett, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 2000-07-18 |
| 6091251 | Discrete die burn-in for nonpackaged die | Tim J. Corbett, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 2000-07-18 |
| 6087845 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 2000-07-11 |