Issued Patents All Time
Showing 326–350 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5952840 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, David R. Hembree, James M. Wark, John O. Jacobson | 1999-09-14 |
| 5949242 | Method and apparatus for testing unpackaged semiconductor dice | Warren M. Farnworth, Salman Akram, David R. Hembree | 1999-09-07 |
| 5946553 | Process for manufacturing a semiconductor package with bi-substrate die | Salman Akram, Warren M. Farnworth | 1999-08-31 |
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Warren M. Farnworth, Salman Akram | 1999-08-03 |
| 5929647 | Method and apparatus for testing semiconductor dice | Salman Akram, David R. Hembree, Warren M. Farnworth | 1999-07-27 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Warren M. Farnworth, Salman Akram | 1999-06-29 |
| 5910640 | Electrical contact assembly for use in a multi-die encapsulation device | Warren M. Farnworth, Tim J. Corbett | 1999-06-08 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 1999-05-25 |
| 5905382 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 1999-05-18 |
| 5905305 | Condensed memory matrix | Rich Fogal | 1999-05-18 |
| 5904546 | Method and apparatus for dicing semiconductor wafers | Warren M. Farnworth, Salman Akram | 1999-05-18 |
| 5903044 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 1999-05-11 |
| 5896036 | Carrier for testing semiconductor dice | Warren M. Farnworth, David R. Hembree | 1999-04-20 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 1999-04-13 |
| 5878485 | Method for fabricating a carrier for testing unpackaged semiconductor dice | Warren M. Farnworth, David R. Hembree | 1999-03-09 |
| 5869974 | Micromachined probe card having compliant contact members for testing semiconductor wafers | Salman Akram, David R. Hembree | 1999-02-09 |
| 5859539 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 1999-01-12 |
| 5851845 | Process for packaging a semiconductor die using dicing and testing | Warren M. Farnworth | 1998-12-22 |
| D402638 | Temporary package for semiconductor dice | Warren M. Farnworth, David R. Hembree, Salman Akram | 1998-12-15 |
| 5844419 | Method for testing semiconductor packages using decoupling capacitors to reduce noise | Salman Akram, David R. Hembree | 1998-12-01 |
| 5844418 | Carrier having interchangeable substrate used for testing of semiconductor dies | Warren M. Farnworth | 1998-12-01 |
| D401567 | Temporary package for semiconductor dice | Warren M. Farnworth, David R. Hembree, Salman Akram | 1998-11-24 |
| 5834945 | High speed temporary package and interconnect for testing semiconductor dice and method of fabrication | Salman Akram, Warren M. Farnworth | 1998-11-10 |
| 5825195 | Method and apparatus for testing an unpackaged semiconductor die | David R. Hembree, Warren M. Farnworth | 1998-10-20 |
| 5824569 | Semiconductor device having ball-bonded pads | J. Mike Brooks, Kevin G. Duesman | 1998-10-20 |