Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8092734 | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers | Tongbi Jiang | 2012-01-10 |
| 7312101 | Packaged microelectronic devices and methods for packaging microelectronic devices | Tongbi Jiang | 2007-12-25 |
| 6740545 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2004-05-25 |
| 6699734 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, Timothy J. Allen | 2004-03-02 |
| 6600215 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, Timothy J. Allen | 2003-07-29 |
| 6579746 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, Timothy J. Allen | 2003-06-17 |
| 6559519 | Integrated circuit device having cyanate ester buffer coat and method of fabricating same | Jerrold L. King, Kevin Schofield | 2003-05-06 |
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2002-12-03 |
| 6420214 | Method of forming an integrated circuit device having cyanate ester buffer coat | Jerrold L. King, Kevin Schofield | 2002-07-16 |
| 6362532 | Semiconductor device having ball-bonded pads | Alan G. Wood, Kevin G. Duesman | 2002-03-26 |
| 6316292 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2001-11-13 |
| 6066514 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 2000-05-23 |
| 6060343 | Method of forming an integrated circuit device having cyanate ester buffer coat | Jerrold L. King, Kevin Schofield | 2000-05-09 |
| 6043564 | Semiconductor device having ball-bonded pads | Alan G. Wood, Kevin G. Duesman | 2000-03-28 |
| 5903046 | Integrated circuit device having cyanate ester buffer coat | Jerrold L. King, Kevin Schofield | 1999-05-11 |
| 5824569 | Semiconductor device having ball-bonded pads | Alan G. Wood, Kevin G. Duesman | 1998-10-20 |
| 5760468 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 1998-06-02 |
| 5583372 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, Walter L. Moden | 1996-12-10 |
| 5496775 | Semiconductor device having ball-bonded pads | — | 1996-03-05 |