Issued Patents All Time
Showing 301–325 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6084288 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 2000-07-04 |
| 6072321 | Micromachined silicon probe card for semiconductor dice and method of fabrication | Salman Akram, David R. Hembree | 2000-06-06 |
| 6072326 | System for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Derek Gochnour, John O. Jacobson | 2000-06-06 |
| 6071757 | Condensed memory matrix | Rich Fogal | 2000-06-06 |
| 6068669 | Compliant interconnect for testing a semiconductor die | Warren M. Farnworth, Salman Akram | 2000-05-30 |
| 6064216 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, David R. Hembree, James M. Wark, John O. Jacobson | 2000-05-16 |
| 6060891 | Probe card for semiconductor wafers and method and system for testing wafers | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2000-05-09 |
| 6048753 | Standardized bonding location process and apparatus | Warren M. Farnworth | 2000-04-11 |
| 6045026 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Warren M. Farnworth | 2000-04-04 |
| 6043564 | Semiconductor device having ball-bonded pads | J. Mike Brooks, Kevin G. Duesman | 2000-03-28 |
| 6040702 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Derek Gochnour, Salman Akram | 2000-03-21 |
| 6028436 | Method for forming coaxial silicon interconnects | Salman Akram, David R. Hembree | 2000-02-22 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, James M. Wark, Derek Gochnour | 2000-02-15 |
| 6020629 | Stacked semiconductor package and method of fabrication | Warren M. Farnworth, Mike Brooks | 2000-02-01 |
| 6020624 | Semiconductor package with bi-substrate die | Salman Akram, Warren M. Farnworth | 2000-02-01 |
| 6016060 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2000-01-18 |
| 6013948 | Stackable chip scale semiconductor package with mating contacts on opposed surfaces | Salman Akram, Warren M. Farnworth | 2000-01-11 |
| RE36469 | Packaging for semiconductor logic devices | Tim J. Corbett | 1999-12-28 |
| 6005290 | Multi chip module having self limiting contact members | Salman Akram, Warren M. Farnworth | 1999-12-21 |
| 6002180 | Multi chip module with conductive adhesive layer | Salman Akram, Warren M. Farnworth | 1999-12-14 |
| 5990566 | High density semiconductor package | Warren M. Farnworth, Salman Akram, Mike Brooks, Eugene H. Cloud | 1999-11-23 |
| 5977629 | Condensed memory matrix | Rich Fogal | 1999-11-02 |
| RE36325 | Directly bonded SIMM module | Tim J. Corbett | 1999-10-05 |
| 5958100 | Process of making a glass semiconductor package | Warren M. Farnworth | 1999-09-28 |
| 5955877 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 1999-09-21 |