Issued Patents All Time
Showing 351–375 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5815000 | Method for testing semiconductor dice with conventionally sized temporary packages | Warren M. Farnworth, David R. Hembree, Salman Akram | 1998-09-29 |
| 5796264 | Apparatus for manufacturing known good semiconductor dice | Warren M. Farnworth | 1998-08-18 |
| 5789278 | Method for fabricating chip modules | Salman Akram, Warren M. Farnworth | 1998-08-04 |
| 5786632 | Semiconductor package | Warren M. Farnworth, Trung T. Doan, John O. Jacobson | 1998-07-28 |
| 5781022 | Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die | Trung T. Doan, Warren M. Farnworth, Tim J. Corbett | 1998-07-14 |
| 5770479 | Bonding support for leads-over-chip process | Mike Brooks | 1998-06-23 |
| 5767443 | Multi-die encapsulation device | Warren M. Farnworth, Tim J. Corbett | 1998-06-16 |
| D394844 | Temporary package for semiconductor dice | Warren M. Farnworth, David R. Hembree, Salman Akram | 1998-06-02 |
| 5739585 | Single piece package for semiconductor die | Salman Akram, Warren M. Farnworth | 1998-04-14 |
| 5726580 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 1998-03-10 |
| 5721496 | Method and apparatus for leak checking unpackaged semiconductor dice | Warren M. Farnworth | 1998-02-24 |
| 5716218 | Process for manufacturing an interconnect for testing a semiconductor die | Warren M. Farnworth, Salman Akram | 1998-02-10 |
| 5714802 | High-density electronic module | Eugene H. Cloud | 1998-02-03 |
| 5686318 | Method of forming a die-to-insert permanent connection | Warren M. Farnworth | 1997-11-11 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Salman Akram, Warren M. Farnworth | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 1997-10-28 |
| 5674785 | Method of producing a single piece package for semiconductor die | Salman Akram, Warren M. Farnworth | 1997-10-07 |
| 5663654 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 1997-09-02 |
| 5640762 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 1997-06-24 |
| 5634267 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 1997-06-03 |
| 5593927 | Method for packaging semiconductor dice | Warren M. Farnworth, Trung T. Doan, John O. Jacobson | 1997-01-14 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Salman Akram, Warren M. Farnworth | 1997-01-14 |
| 5585282 | Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor | Trung T. Doan, Warren M. Farnworth, Tim J. Corbett | 1996-12-17 |
| 5578526 | Method for forming a multi chip module (MCM) | Salman Akram, Warren M. Farnworth | 1996-11-26 |
| 5578934 | Method and apparatus for testing unpackaged semiconductor dice | Warren M. Farnworth, Salman Akram, David R. Hembree | 1996-11-26 |