Issued Patents All Time
Showing 376–399 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5541525 | Carrier for testing an unpackaged semiconductor die | Warren M. Farnworth, David R. Hembree | 1996-07-30 |
| 5539324 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 1996-07-23 |
| 5519332 | Carrier for testing an unpackaged semiconductor die | Warren M. Farnworth, David R. Hembree | 1996-05-21 |
| 5495667 | Method for forming contact pins for semiconductor dice and interconnects | Warren M. Farnworth, Salman Akram | 1996-03-05 |
| 5495179 | Carrier having interchangeable substrate used for testing of semiconductor dies | Warren M. Farnworth | 1996-02-27 |
| 5483741 | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice | Salman Akram, Warren M. Farnworth | 1996-01-16 |
| 5440240 | Z-axis interconnect for discrete die burn-in for nonpackaged die | Warren M. Farnworth, David R. Hembree | 1995-08-08 |
| 5424652 | Method and apparatus for testing an unpackaged semiconductor die | David R. Hembree, Warren M. Farnworth | 1995-06-13 |
| 5408190 | Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die | Warren M. Farnworth, David R. Hembree | 1995-04-18 |
| 5367253 | Clamped carrier for testing of semiconductor dies | David R. Hembree, Warren M. Farnworth | 1994-11-22 |
| 5342807 | Soft bond for semiconductor dies | Larry D. Kinsman, Derek Gochnour, Warren M. Farnworth | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Larry D. Kinsman, Derek Gochnour, Warren M. Farnworth | 1994-08-09 |
| 5302891 | Discrete die burn-in for non-packaged die | Tim J. Corbett, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 1994-04-12 |
| 5256598 | Shrink accommodating lead frame | Warren M. Farnworth | 1993-10-26 |
| 5249450 | Probehead for ultrasonic forging | David R. Hembree, Warren M. Farnworth, Larry D. Cromar | 1993-10-05 |
| 5155067 | Packaging for a semiconductor die | Eugene H. Cloud, Larry D. Kinsman | 1992-10-13 |
| 5145099 | Method for combining die attach and lead bond in the assembly of a semiconductor package | Warren M. Farnworth, George P. McGill | 1992-09-08 |
| 5138434 | Packaging for semiconductor logic devices | Tim J. Corbett | 1992-08-11 |
| 5062565 | Method for combining die attach and wirebond in the assembly of a semiconductor package | Warren M. Farnworth, George P. McGill | 1991-11-05 |
| 4992850 | Directly bonded simm module | Tim J. Corbett | 1991-02-12 |
| 4992849 | Directly bonded board multiple integrated circuit module | Tim J. Corbett | 1991-02-12 |
| 4949161 | Interdigitized leadframe strip | Timothy J. Allen | 1990-08-14 |
| 4906314 | Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer | Warren M. Farnworth | 1990-03-06 |
| 4899107 | Discrete die burn-in for nonpackaged die | Tim J. Corbett | 1990-02-06 |