Issued Patents All Time
Showing 76–100 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7382060 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts | Warren M. Farnworth, Trung T. Doan | 2008-06-03 |
| 7362113 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2008-04-22 |
| 7358751 | Contact pin assembly and contactor card | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2008-04-15 |
| 7335994 | Semiconductor component having multiple stacked dice | Dean A. Klein, Trung T. Doan | 2008-02-26 |
| 7307348 | Semiconductor components having through wire interconnects (TWI) | David R. Hembree | 2007-12-11 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2007-11-27 |
| 7297563 | Method of making contact pin card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2007-11-20 |
| 7294897 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, William M. Hiatt | 2007-11-13 |
| 7288757 | Microelectronic imaging devices and associated methods for attaching transmissive elements | Warren M. Farnworth | 2007-10-30 |
| 7288953 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2007-10-30 |
| 7287326 | Methods of forming a contact pin assembly | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2007-10-30 |
| 7288954 | Compliant contact pin test assembly and methods thereof | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2007-10-30 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2007-10-16 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2007-09-04 |
| 7259578 | System for testing semiconductor components having interconnect with variable flexure contacts | Salman Akram | 2007-08-21 |
| 7259450 | Double-packaged multi-chip semiconductor module | Eugene H. Cloud, Larry D. Kinsman | 2007-08-21 |
| 7256490 | Test carrier for semiconductor components having conductors defined by grooves | Warren M. Farnworth | 2007-08-14 |
| 7256069 | Wafer-level package and methods of fabricating | Salman Akram | 2007-08-14 |
| 7250780 | Probe card for semiconductor wafers having mounting plate and socket | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2007-07-31 |
| 7235431 | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material | Warren M. Farnworth, Charles M. Watkins, Peter Benson | 2007-06-26 |
| 7224051 | Semiconductor component having plate and stacked dice | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2007-05-29 |
| 7223626 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, James M. Wark, David R. Hembree, Rickie C. Lake | 2007-05-29 |
| 7221059 | Wafer level semiconductor component having thinned, encapsulated dice and polymer dam | Warren M. Farnworth, Trung T. Doan | 2007-05-22 |
| 7216009 | Machine vision systems for use with programmable material consolidation system and associated methods and structures | Warren M. Farnworth | 2007-05-08 |
| 7214962 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Warren M. Farnworth | 2007-05-08 |