Issued Patents All Time
Showing 26–50 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, William M. Hiatt | 2011-11-08 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | William M. Hiatt, David R. Hembree | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | William M. Hiatt, David R. Hembree | 2011-05-03 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) | David R. Hembree | 2011-02-08 |
| 7880307 | Semiconductor device including through-wafer interconnect structure | Warren M. Farnworth | 2011-02-01 |
| 7858429 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, William M. Hiatt | 2010-12-28 |
| 7855140 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Salman Akram, Warren M. Farnworth | 2010-12-21 |
| 7833832 | Method of fabricating semiconductor components with through interconnects | Warren M. Farnworth, David R. Hembree | 2010-11-16 |
| 7807505 | Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods | Warren M. Farnworth | 2010-10-05 |
| 7791184 | Image sensor packages and frame structure thereof | Kyle K. Kirby, Warren M. Farnworth, Salman Akram | 2010-09-07 |
| 7786605 | Stacked semiconductor components with through wire interconnects (TWI) | David R. Hembree | 2010-08-31 |
| 7776647 | Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors | Warren M. Farnworth, Trung T. Doan | 2010-08-17 |
| 7768096 | System for fabricating semiconductor components with conductive interconnects | William M. Hiatt, David R. Hembree | 2010-08-03 |
| 7727872 | Methods for fabricating semiconductor components with conductive interconnects | William M. Hiatt, David R. Hembree | 2010-06-01 |
| 7723741 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, James M. Wark, David R. Hembree, Rickie C. Lake | 2010-05-25 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2010-05-04 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2010-03-23 |
| 7663096 | Microelectronic imaging devices and associated methods for attaching transmissive elements | Warren M. Farnworth | 2010-02-16 |
| 7659612 | Semiconductor components having encapsulated through wire interconnects (TWI) | David R. Hembree | 2010-02-09 |
| 7645635 | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages | Kyle K. Kirby, Warren M. Farnworth, Salman Akram | 2010-01-12 |
| 7598167 | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures | Charles M. Watkins, Kyle K. Kirby, Salman Akram, Warren M. Farnworth | 2009-10-06 |