Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862611 | Thermal transfer structures for semiconductor die assemblies | — | 2024-01-02 |
| 11222868 | Thermal transfer structures for semiconductor die assemblies | — | 2022-01-11 |
| 8455983 | Microelectronic device wafers and methods of manufacturing | Alan G. Wood, Ford B. Grigg | 2013-06-04 |
| 8062958 | Microelectronic device wafers and methods of manufacturing | Alan G. Wood, Ford B. Grigg | 2011-11-22 |
| 7220616 | Methods for epoxy loc die attachment | — | 2007-05-22 |
| 7153788 | Method and apparatus for attaching a workpiece to a workpiece support | Tongbi Jiang | 2006-12-26 |
| 7115976 | Method and apparatus for epoxy LOC die attachment | — | 2006-10-03 |
| 6858469 | Method and apparatus for epoxy loc die attachment | — | 2005-02-22 |
| 6719550 | Apparatus for epoxy loc die attachment | — | 2004-04-13 |
| 6562277 | Method and apparatus for attaching a workpiece to a workpiece support | Tongbi Jiang | 2003-05-13 |
| 6352422 | Method and apparatus for epoxy loc die attachment | — | 2002-03-05 |
| 6353268 | Semiconductor die attachment method and apparatus | Chad A. Cobbley, Tongbi Jiang | 2002-03-05 |
| 6221691 | Method and system for attaching semiconductor dice to substrates | — | 2001-04-24 |
| 6174752 | Method and apparatus for epoxy loc die attachment | — | 2001-01-16 |
| 6110805 | Method and apparatus for attaching a workpiece to a workpiece support | Tongbi Jiang | 2000-08-29 |
| 6084311 | Method and apparatus for reducing resin bleed during the formation of a semiconductor device | Tongbi Jiang, John VanNortwick | 2000-07-04 |
| 6051449 | Method and apparatus for Epoxy loc die attachment | — | 2000-04-18 |
| 6016004 | Method and apparatus for epoxy loc die attachment | — | 2000-01-18 |
| 5861678 | Method and system for attaching semiconductor dice to substrates | — | 1999-01-19 |
| 5031360 | Broken blade detector for semiconductor die saws | Warren M. Farnworth | 1991-07-16 |