| 11862611 |
Thermal transfer structures for semiconductor die assemblies |
— |
2024-01-02 |
| 11222868 |
Thermal transfer structures for semiconductor die assemblies |
— |
2022-01-11 |
| 8455983 |
Microelectronic device wafers and methods of manufacturing |
Alan G. Wood, Ford B. Grigg |
2013-06-04 |
| 8062958 |
Microelectronic device wafers and methods of manufacturing |
Alan G. Wood, Ford B. Grigg |
2011-11-22 |
| 7220616 |
Methods for epoxy loc die attachment |
— |
2007-05-22 |
| 7153788 |
Method and apparatus for attaching a workpiece to a workpiece support |
Tongbi Jiang |
2006-12-26 |
| 7115976 |
Method and apparatus for epoxy LOC die attachment |
— |
2006-10-03 |
| 6858469 |
Method and apparatus for epoxy loc die attachment |
— |
2005-02-22 |
| 6719550 |
Apparatus for epoxy loc die attachment |
— |
2004-04-13 |
| 6562277 |
Method and apparatus for attaching a workpiece to a workpiece support |
Tongbi Jiang |
2003-05-13 |
| 6352422 |
Method and apparatus for epoxy loc die attachment |
— |
2002-03-05 |
| 6353268 |
Semiconductor die attachment method and apparatus |
Chad A. Cobbley, Tongbi Jiang |
2002-03-05 |
| 6221691 |
Method and system for attaching semiconductor dice to substrates |
— |
2001-04-24 |
| 6174752 |
Method and apparatus for epoxy loc die attachment |
— |
2001-01-16 |
| 6110805 |
Method and apparatus for attaching a workpiece to a workpiece support |
Tongbi Jiang |
2000-08-29 |
| 6084311 |
Method and apparatus for reducing resin bleed during the formation of a semiconductor device |
Tongbi Jiang, John VanNortwick |
2000-07-04 |
| 6051449 |
Method and apparatus for Epoxy loc die attachment |
— |
2000-04-18 |
| 6016004 |
Method and apparatus for epoxy loc die attachment |
— |
2000-01-18 |
| 5861678 |
Method and system for attaching semiconductor dice to substrates |
— |
1999-01-19 |
| 5031360 |
Broken blade detector for semiconductor die saws |
Warren M. Farnworth |
1991-07-16 |
