Issued Patents All Time
Showing 26–50 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546931 | Stacked semiconductor components having conductive interconnects | Alan G. Wood, David R. Hembree | 2013-10-01 |
| 8536485 | Systems and methods for forming apertures in microfeature workpieces | Charles M. Watkins | 2013-09-17 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2013-08-06 |
| 8404521 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, Kyle K. Kirby | 2013-03-26 |
| 8324100 | Methods of forming conductive vias | Salman Akram, Steven Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2012-12-04 |
| 8308053 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rick Lake | 2012-11-13 |
| 8291966 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, Nishant Sinha | 2012-10-23 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2012-10-23 |
| 8268715 | Multi-component integrated circuit contacts | Warren M. Farnworth | 2012-09-18 |
| 8253230 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, Kyle K. Kirby | 2012-08-28 |
| 8105862 | Imager with tuned color filter | Ulrich Boettiger, Jeffrey McKee | 2012-01-31 |
| 8084866 | Microelectronic devices and methods for filling vias in microelectronic devices | Kyle K. Kirby | 2011-12-27 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, Alan G. Wood | 2011-11-08 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, Salman Akram | 2011-10-11 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, Peter Benson +2 more | 2011-06-14 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | Alan G. Wood, David R. Hembree | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | Alan G. Wood, David R. Hembree | 2011-05-03 |
| 7915736 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Kyle K. Kirby, Richard L. Stocks | 2011-03-29 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7863187 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Ross S. Dando | 2011-01-04 |
| 7858429 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Kyle K. Kirby, Alan G. Wood | 2010-12-28 |
| 7855454 | Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures | Salman Akram, James M. Wark | 2010-12-21 |
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth | 2010-11-09 |
| 7791207 | Pass through via technology for use during the manufacture of a semiconductor device | — | 2010-09-07 |
| 7768096 | System for fabricating semiconductor components with conductive interconnects | Alan G. Wood, David R. Hembree | 2010-08-03 |