Issued Patents All Time
Showing 26–50 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8435836 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, David R. Hembree | 2013-05-07 |
| 8395242 | Semiconductor device having backside redistribution layers | Steve Oliver | 2013-03-12 |
| 8308053 | Microfeature workpieces having alloyed conductive structures, and associated methods | Rick Lake, William M. Hiatt | 2012-11-13 |
| 8291966 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, William M. Hiatt, Nishant Sinha | 2012-10-23 |
| 8268715 | Multi-component integrated circuit contacts | William M. Hiatt | 2012-09-18 |
| 8129847 | Interconnect and method for mounting an electronic device to a substrate | — | 2012-03-06 |
| 8129839 | Electronic device package structures | — | 2012-03-06 |
| 8115269 | Integrated circuit package having reduced interconnects | Jerry M. Brooks | 2012-02-14 |
| 8053279 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Tom A. Muntifering, Paul J. Clawson | 2011-11-08 |
| 7989022 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Kyle K. Kirby | 2011-08-02 |
| 7964971 | Flexible column die interconnects and structures including same | — | 2011-06-21 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7932179 | Method for fabricating semiconductor device having backside redistribution layers | Steve Oliver | 2011-04-26 |
| 7923298 | Imager die package and methods of packaging an imager die on a temporary carrier | Steven Oliver | 2011-04-12 |
| 7918383 | Methods for placing substrates in contact with molten solder | Kyle K. Kirby, Salman Akram, Daniel P. Cram, Roy Lange | 2011-04-05 |
| 7880307 | Semiconductor device including through-wafer interconnect structure | Alan G. Wood | 2011-02-01 |
| 7875529 | Semiconductor devices | Leonard Forbes, Paul A. Farrar, Arup Bhattacharyya, Hussein I. Hanafi | 2011-01-25 |
| 7872332 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, David R. Hembree | 2011-01-18 |
| 7871859 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2011-01-18 |
| 7855140 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Salman Akram | 2010-12-21 |
| 7833456 | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece | — | 2010-11-16 |
| 7833832 | Method of fabricating semiconductor components with through interconnects | Alan G. Wood, David R. Hembree | 2010-11-16 |
| 7833881 | Methods for fabricating semiconductor components and packaged semiconductor components | — | 2010-11-16 |
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, William M. Hiatt | 2010-11-09 |