| 11011521 |
Semiconductor structure patterning |
Sevim Korkmaz, Devesh Dadhich Shreeram, Srinivasan Balakrishnan, Sanjeev Sapra, Paul A. Paduano |
2021-05-18 |
| 10964475 |
Formation of a capacitor using a sacrificial layer |
Devesh Dadhich Shreeram, Sevim Korkmaz, Jian Li, Sanjeev Sapra |
2021-03-30 |
| 10020287 |
Pass-through interconnect structure for microelectronic dies and associated systems and methods |
David S. Pratt, Kyle K. Kirby |
2018-07-10 |
| 9209158 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods |
David S. Pratt, Kyle K. Kirby |
2015-12-08 |
| 8929052 |
Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
Warren M. Farnworth, Kyle K. Kirby |
2015-01-06 |
| 8503156 |
Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
Warren M. Farnworth, Kyle K. Kirby |
2013-08-06 |
| 8084854 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods |
David S. Pratt, Kyle K. Kirby |
2011-12-27 |
| 7989022 |
Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
Warren M. Farnworth, Kyle K. Kirby |
2011-08-02 |