Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011521 | Semiconductor structure patterning | Sevim Korkmaz, Devesh Dadhich Shreeram, Srinivasan Balakrishnan, Sanjeev Sapra, Paul A. Paduano | 2021-05-18 |
| 10964475 | Formation of a capacitor using a sacrificial layer | Devesh Dadhich Shreeram, Sevim Korkmaz, Jian Li, Sanjeev Sapra | 2021-03-30 |
| 10020287 | Pass-through interconnect structure for microelectronic dies and associated systems and methods | David S. Pratt, Kyle K. Kirby | 2018-07-10 |
| 9209158 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | David S. Pratt, Kyle K. Kirby | 2015-12-08 |
| 8929052 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Warren M. Farnworth, Kyle K. Kirby | 2015-01-06 |
| 8503156 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Warren M. Farnworth, Kyle K. Kirby | 2013-08-06 |
| 8084854 | Pass-through 3D interconnect for microelectronic dies and associated systems and methods | David S. Pratt, Kyle K. Kirby | 2011-12-27 |
| 7989022 | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Warren M. Farnworth, Kyle K. Kirby | 2011-08-02 |