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Dewali Ray — 8 Patents

Micron: 8 patents #1,761 of 6,374Top 30%
Boise, ID: #924 of 3,546 inventorsTop 30%
Idaho: #1,540 of 8,810 inventorsTop 20%
Overall (All Time): #600,572 of 4,157,543Top 15%
8 Patents All Time
Dewali Ray has been granted 8 US patents while listed as an inventor at Micron. The first was granted in 2011 and the most recent in May 2021. Dewali Ray ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Dewali Ray in Boise, ID, US.

Patents per Year

Patents granted per year, 2011 to 2021Bar chart with a peak of 2 patents in 2011.peak 22011: 2 patents20112013: 1 patents20132015: 2 patents20152018: 1 patents20182021: 2 patents2021

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11011521 Semiconductor structure patterning Sevim Korkmaz, Devesh Dadhich Shreeram, Srinivasan Balakrishnan, Sanjeev Sapra, Paul A. Paduano 2021-05-18 $21,936,000
10964475 Formation of a capacitor using a sacrificial layer Devesh Dadhich Shreeram, Sevim Korkmaz, Jian Li, Sanjeev Sapra 2021-03-30 $32,966,000
10020287 Pass-through interconnect structure for microelectronic dies and associated systems and methods David S. Pratt, Kyle K. Kirby 2018-07-10 $35,377,000
9209158 Pass-through 3D interconnect for microelectronic dies and associated systems and methods David S. Pratt, Kyle K. Kirby 2015-12-08 $8,863,000
8929052 Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto Warren M. Farnworth, Kyle K. Kirby 2015-01-06 $15,780,000
8503156 Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto Warren M. Farnworth, Kyle K. Kirby 2013-08-06 $3,661,000
8084854 Pass-through 3D interconnect for microelectronic dies and associated systems and methods David S. Pratt, Kyle K. Kirby 2011-12-27 $3,358,000
7989022 Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto Warren M. Farnworth, Kyle K. Kirby 2011-08-02 $1,985,000

Frequent Collaborators

Kyle K. Kirby6 shared
Warren M. Farnworth3 shared
David S. Pratt3 shared
Sevim Korkmaz2 shared
Devesh Dadhich Shreeram2 shared
Sanjeev Sapra2 shared

Nearby-Ranked Inventors

Suryatej Gundavelli8
Hajime Yoshizawa8
Takahisa TATEKAWA8
Hye-Jin GONG8
Yang Ji8
Koichi Sekimizu8
Sandeep Rekhi8
Tejas Pradip Rode8
Jonatan Hörder8