| 12387981 |
Methods for forming conductive vias, and associated devices and systems |
Trupti D. Gawai, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed +2 more |
2025-08-12 |
|
| 11990370 |
Methods for forming conductive vias, and associated devices and systems |
Trupti D. Gawai, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed +2 more |
2024-05-21 |
$36,516,000 |
| 11784077 |
Wafer overlay marks, overlay measurement systems, and related methods |
Denzil S. Frost, Richard T. Housley, Trupti D. Gawai |
2023-10-10 |
$11,017,000 |
| 11574842 |
Methods for forming conductive vias, and associated devices and systems |
Trupti D. Gawai, David A. Kewley, Aaron Michael Lowe, Radhakrishna Kotti |
2023-02-07 |
$15,619,000 |
| 11515204 |
Methods for forming conductive vias, and associated devices and systems |
Trupti D. Gawai, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed +2 more |
2022-11-29 |
$10,551,000 |
| 10963942 |
Systems, methods, and devices for generating recommendations of unique items |
David Wayne Franke, Joshua Howard Levy, Hans Ulrich Grasemann, Lauri Moore, William T. Moose +2 more |
2021-03-30 |
|
| 10127596 |
Systems, methods, and devices for generating recommendations of unique items |
David Wayne Franke, Joshua Howard Levy, Hans Ulrich Grasemann, Lauri Moore, William T. Moose +2 more |
2018-11-13 |
|
| 10057415 |
Method and apparatus for remote control and updating of wireless mobile devices |
Ronald Craswell, Paul Klassen |
2018-08-21 |
|
| 10020287 |
Pass-through interconnect structure for microelectronic dies and associated systems and methods |
Kyle K. Kirby, Dewali Ray |
2018-07-10 |
$35,377,000 |
| 9842806 |
Stacked semiconductor devices |
— |
2017-12-12 |
$37,354,000 |
| 9711457 |
Semiconductor devices with recessed interconnects |
— |
2017-07-18 |
$14,269,000 |
| 9418970 |
Redistribution layers for microfeature workpieces, and associated systems and methods |
— |
2016-08-16 |
$10,478,000 |
| 9355934 |
Method and apparatus providing integrated circuit having redistribution layer with recessed connectors |
— |
2016-05-31 |
$8,282,000 |
| 9337537 |
Antenna with tunable high band parasitic element |
Hongfei Hu, Mattia Pascolini, Enrique Ayala Vazquez, Matthew A. Mow, Dean F. Darnell +5 more |
2016-05-10 |
$45,935,000 |
| 9324721 |
Pitch-halving integrated circuit process |
Richard T. Housley |
2016-04-26 |
|
| 9276319 |
Electronic device antenna with multiple feeds for covering three communications bands |
Enrique Ayala Vazquez, Hongfei Hu, Mattia Pascolini, Matthew A. Mow, Ming-Ju Tsai +5 more |
2016-03-01 |
$57,077,000 |
| 9245844 |
Pitch-halving integrated circuit process and integrated circuit structure made thereby |
Richard T. Housley |
2016-01-26 |
|
| 9230859 |
Redistribution layers for microfeature workpieces, and associated systems and methods |
— |
2016-01-05 |
$5,653,000 |
| 9209158 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods |
Kyle K. Kirby, Dewali Ray |
2015-12-08 |
$8,863,000 |
| 9209166 |
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices |
— |
2015-12-08 |
$8,863,000 |
| 9166634 |
Electronic device with multiple antenna feeds and adjustable filter and matching circuitry |
Dean F. Darnell, Enrique Ayala Vazquez, Hongfei Hu, Yuehui Ouyang, Mattia Pascolini +10 more |
2015-10-20 |
$121,568,000 |
| 9054165 |
Semiconductor devices including a through-substrate conductive member with an exposed end |
— |
2015-06-09 |
$11,836,000 |
| 8994163 |
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices |
— |
2015-03-31 |
$12,721,000 |
| 8853868 |
Semiconductor structures including sub-resolution alignment marks |
Marc Sulfridge |
2014-10-07 |
$11,727,000 |
| 8779605 |
Method and apparatus providing integrated circuit having redistribution layer with recessed connectors |
— |
2014-07-15 |
$15,666,000 |
