Issued Patents All Time
Showing 51–75 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, William M. Hiatt | 2010-11-09 |
| 7807505 | Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods | Alan G. Wood | 2010-10-05 |
| 7791184 | Image sensor packages and frame structure thereof | Alan G. Wood, Kyle K. Kirby, Salman Akram | 2010-09-07 |
| 7785915 | Wafer level method of locating focal plane of imager devices | — | 2010-08-31 |
| 7776647 | Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors | Alan G. Wood, Trung T. Doan | 2010-08-17 |
| 7768040 | Imager device with electric connections to electrical device | — | 2010-08-03 |
| 7759240 | Use of palladium in IC manufacturing with conductive polymer bump | Salman Akram | 2010-07-20 |
| 7730372 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 2010-06-01 |
| 7723741 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Alan G. Wood, James M. Wark, David R. Hembree, Rickie C. Lake | 2010-05-25 |
| 7719120 | Multi-component integrated circuit contacts | William M. Hiatt | 2010-05-18 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, David R. Hembree, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2010-05-04 |
| 7701039 | Semiconductor devices and in-process semiconductor devices having conductor filled vias | Kyle K. Kirby | 2010-04-20 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2010-03-23 |
| 7674652 | Methods of forming an integrated circuit package | Jerry M. Brooks | 2010-03-09 |
| 7663096 | Microelectronic imaging devices and associated methods for attaching transmissive elements | Alan G. Wood | 2010-02-16 |
| 7649145 | Compliant spring contact structures | Kyle K. Kirby | 2010-01-19 |
| 7645635 | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages | Alan G. Wood, Kyle K. Kirby, Salman Akram | 2010-01-12 |
| 7632713 | Methods of packaging microelectronic imaging devices | William M. Hiatt | 2009-12-15 |
| 7626269 | Semiconductor constructions and assemblies, and electronic systems | Steve Oliver | 2009-12-01 |
| 7603772 | Methods of fabricating substrates including one or more conductive vias | Steven M. McDonald, Nishant Sinha, William M. Hiatt | 2009-10-20 |
| 7600314 | Methods for installing a plurality of circuit devices | Larry D. Kinsman, Mike Brooks, Walter L. Moden, Terry R. Lee | 2009-10-13 |
| 7598167 | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Salman Akram | 2009-10-06 |
| 7594322 | Methods of fabricating substrates including at least one conductive via | Steven M. McDonald, Nishant Sinha, William M. Hiatt | 2009-09-29 |
| 7591069 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Alan G. Wood | 2009-09-22 |