Issued Patents All Time
Showing 101–125 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Mark E. Tuttle +3 more | 2008-11-18 |
| 7449910 | Test system for semiconductor components having conductive spring contacts | Kyle K. Kirby | 2008-11-11 |
| 7446028 | Multi-component integrated circuit contacts | William M. Hiatt | 2008-11-04 |
| 7442578 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices | Tongbi Jiang, Curtis Hollingshead | 2008-10-28 |
| 7442643 | Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials | Alan G. Wood, Charles M. Watkins, Peter Benson | 2008-10-28 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice | Alan G. Wood, Trung T. Doan | 2008-10-07 |
| 7429529 | Methods of forming through-wafer interconnects and structures resulting therefrom | Alan G. Wood | 2008-09-30 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson, James M. Wark +4 more | 2008-09-02 |
| 7417325 | Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts | Alan G. Wood, Trung T. Doan | 2008-08-26 |
| 7411304 | Semiconductor interconnect having conductive spring contacts | Kyle K. Kirby | 2008-08-12 |
| 7394267 | Compliant contact pin assembly and card system | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-07-01 |
| 7391117 | Method for fabricating semiconductor components with conductive spring contacts | Kyle K. Kirby | 2008-06-24 |
| 7382060 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts | Alan G. Wood, Trung T. Doan | 2008-06-03 |
| 7378342 | Methods for forming vias varying lateral dimensions | Kyle K. Kirby | 2008-05-27 |
| 7367845 | Modular sockets using flexible interconnects | David J. Corisis, Salman Akram | 2008-05-06 |
| 7358751 | Contact pin assembly and contactor card | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-04-15 |
| 7355267 | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements | Kyle K. Kirby | 2008-04-08 |
| 7342409 | System for testing semiconductor components | Mark E. Tuttle | 2008-03-11 |
| 7335988 | Use of palladium in IC manufacturing with conductive polymer bump | Salman Akram | 2008-02-26 |
| 7335981 | Methods for creating electrophoretically insulated vias in semiconductive substrates | Dale W. Collins, Steven M. McDonald | 2008-02-26 |
| 7330036 | Engagement Probes | Malcolm Grief | 2008-02-12 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, William M. Hiatt | 2008-02-12 |
| 7329899 | Wafer-level redistribution circuit | Steven M. McDonald | 2008-02-12 |
| 7323896 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2008-01-29 |
| 7317322 | Interconnect for bumped semiconductor components | Salman Akram | 2008-01-08 |