Issued Patents All Time
Showing 126–150 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7316063 | Methods of fabricating substrates including at least one conductive via | Steven M. McDonald, Nishant Sinha, William M. Hiatt | 2008-01-08 |
| 7315179 | System for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2008-01-01 |
| 7314821 | Method for fabricating a semiconductor interconnect having conductive spring contacts | Kyle K. Kirby | 2008-01-01 |
| 7304491 | Interconnect for testing semiconductor components | Mark E. Tuttle | 2007-12-04 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2007-11-27 |
| 7297563 | Method of making contact pin card system | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-11-20 |
| 7295462 | Method and apparatus processing variable resistance memory cell write operation | — | 2007-11-13 |
| 7287326 | Methods of forming a contact pin assembly | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7288757 | Microelectronic imaging devices and associated methods for attaching transmissive elements | Alan G. Wood | 2007-10-30 |
| 7288954 | Compliant contact pin test assembly and methods thereof | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7285502 | Methods for forming porous insulator structures on semiconductor devices | Tongbi Jiang | 2007-10-23 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof | Kyle K. Kirby, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-16 |
| 7282806 | Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material | David R. Hembree | 2007-10-16 |
| 7282784 | Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures | Kyle K. Kirby | 2007-10-16 |
| 7276927 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2007-10-02 |
| 7275925 | Apparatus for stereolithographic processing of components and assemblies | — | 2007-10-02 |
| 7276926 | Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2007-10-02 |
| 7271611 | Method for testing semiconductor components using bonded electrical connections | Mark E. Tuttle | 2007-09-18 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2007-09-04 |
| 7262487 | Semiconductor devices and other electronic components including porous insulators created from “void” creating materials | Tongbi Jiang | 2007-08-28 |
| 7262405 | Prefabricated housings for microelectronic imagers | Sidney B. Rigg, David R. Hembree, William M. Hiatt | 2007-08-28 |
| 7259581 | Method for testing semiconductor components | Mark E. Tuttle | 2007-08-21 |
| 7256116 | Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts | William M. Hiatt, Charles M. Watkins, Nishant Sinha | 2007-08-14 |
| 7256490 | Test carrier for semiconductor components having conductors defined by grooves | Alan G. Wood | 2007-08-14 |
| 7256115 | Asymmetric plating | Joseph T. Lindgren | 2007-08-14 |