Issued Patents All Time
Showing 176–200 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7153754 | Methods for forming porous insulators from “void” creating materials and structures and semiconductor devices including same | Tongbi Jiang | 2006-12-26 |
| 7153164 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2006-12-26 |
| 7138334 | Systems for forming insulative coatings for via holes in semiconductor devices | — | 2006-11-21 |
| 7132750 | Semiconductor component having conductors with wire bondable metalization layers | — | 2006-11-07 |
| 7132366 | Method for fabricating semiconductor components using conductive layer and grooves | Alan G. Wood | 2006-11-07 |
| 7129567 | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements | Kyle K. Kirby | 2006-10-31 |
| 7129573 | System having semiconductor component with encapsulated, bonded, interconnect contacts | William M. Hiatt, Charles M. Watkins, Nishant Sinha | 2006-10-31 |
| 7128551 | Surface smoothing of stereolithographically formed 3-D objects | Kevin G. Duesman | 2006-10-31 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2006-10-10 |
| 7115998 | Multi-component integrated circuit contacts | William M. Hiatt | 2006-10-03 |
| 7116118 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Malcolm Grief, Gurtej S. Sandhu | 2006-10-03 |
| 7105437 | Methods for creating electrophoretically insulated vias in semiconductive substrates | Dale W. Collins, Steven M. McDonald | 2006-09-12 |
| 7105921 | Semiconductor assemblies having electrophoretically insulated vias | Dale W. Collins, Steven M. McDonald | 2006-09-12 |
| 7101792 | Methods of plating via interconnects | Kyle K. Kirby | 2006-09-05 |
| 7098475 | Apparatuses configured to engage a conductive pad | Malcolm Grief, Gurtej S. Sandhu | 2006-08-29 |
| 7094628 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices | Tongbi Jiang, Curtis Hollingshead | 2006-08-22 |
| 7093358 | Method for fabricating an interposer | Salman Akram, Alan G. Wood | 2006-08-22 |
| 7094108 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2006-08-22 |
| 7094117 | Electrical contacts with dielectric cores | William M. Hiatt, Charles M. Watkins | 2006-08-22 |
| 7087995 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | William M. Hiatt | 2006-08-08 |
| 7082681 | Methods for modifying a vertical surface mount package | Larry D. Kinsman, Walter L. Moden | 2006-08-01 |
| 7084013 | Methods for forming protective layers on semiconductor device substrates | Alan G. Wood | 2006-08-01 |
| 7084351 | Electrical device allowing for increased device densities | Salman Akram, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2006-08-01 |
| 7081385 | Nanotube semiconductor devices and methods for making the same | Kevin G. Duesman | 2006-07-25 |
| 7067901 | Semiconductor devices including protective layers on active surfaces thereof | Alan G. Wood | 2006-06-27 |