Issued Patents All Time
Showing 201–225 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7065868 | Methods for installing a circuit device | Larry D. Kinsman, Mike Brooks, Walter L. Moden, Terry R. Lee | 2006-06-27 |
| 7064010 | Methods of coating and singulating wafers | Kyle K. Kirby, William M. Hiatt | 2006-06-20 |
| 7063524 | Apparatus for increased dimensional accuracy of 3-D object creation | Kevin G. Duesman | 2006-06-20 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-06-13 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Alan G. Wood, James M. Wark, Derek Gochnour | 2006-05-23 |
| 7043831 | Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate | Salman Akram | 2006-05-16 |
| 7043830 | Method of forming conductive bumps | — | 2006-05-16 |
| 7042080 | Semiconductor interconnect having compliant conductive contacts | Kyle K. Kirby | 2006-05-09 |
| 7040930 | Modular sockets using flexible interconnects | David J. Corisis, Salman Akram | 2006-05-09 |
| 7034561 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2006-04-25 |
| 7034560 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 2006-04-25 |
| 7030010 | Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures | Dale W. Collins, Steven M. McDonald | 2006-04-18 |
| 7029949 | Method for fabricating encapsulated semiconductor components having conductive vias | Alan G. Wood, Trung T. Doan | 2006-04-18 |
| 7026835 | Engagement probe having a grouping of projecting apexes for engaging a conductive pad | Malcolm Grief, Gurtej S. Sandhu | 2006-04-11 |
| 7022533 | Substrate mapping | Derek Gochnour | 2006-04-04 |
| 7021915 | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length | — | 2006-04-04 |
| 7003874 | Methods of bonding solder balls to bond pads on a substrate | Alan G. Wood | 2006-02-28 |
| 7002362 | Test system for bumped semiconductor components | Salman Akram | 2006-02-21 |
| 6998717 | Multi-dice chip scale semiconductor components | Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-02-14 |
| 6998344 | Method for fabricating semiconductor components by forming conductive members using solder | Salman Akram, Alan G. Wood | 2006-02-14 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more | 2006-02-14 |
| 6995577 | Contact for semiconductor components | Salman Akram | 2006-02-07 |
| 6992398 | Underfill and encapsulation of carrier substrate-mounted flip-chip components | — | 2006-01-31 |
| 6984583 | Stereolithographic method for forming insulative coatings for via holes in semiconductor devices | — | 2006-01-10 |
| 6983536 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 2006-01-10 |