Issued Patents All Time
Showing 226–250 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979904 | Integrated circuit package having reduced interconnects | Jerry M. Brooks | 2005-12-27 |
| 6980014 | Interposer and methods for fabricating same | Salman Akram, Alan G. Wood | 2005-12-27 |
| 6980017 | Test interconnect for bumped semiconductor components and method of fabrication | Salman Akram | 2005-12-27 |
| 6979888 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2005-12-27 |
| 6979898 | Semiconductor component and a method of fabricating the semiconductor component | Alan G. Wood | 2005-12-27 |
| 6975037 | Semiconductor package having flex circuit with external contacts | Alan G. Wood, Mike Brooks | 2005-12-13 |
| 6974725 | Interconnections for a semiconductor device | Walter L. Moden, Larry D. Kinsman | 2005-12-13 |
| 6972249 | Use of nitrides for flip-chip encapsulation | Salman Akram | 2005-12-06 |
| 6969681 | Method for fabricating a semiconductor component using contact printing | — | 2005-11-29 |
| 6967307 | Method and process of contact to a heat softened solder ball array | David R. Hembree | 2005-11-22 |
| 6964915 | Method of fabricating encapsulated semiconductor components by etching | Alan G. Wood, Trung T. Doan | 2005-11-15 |
| 6963128 | Vertically mountable and alignable semiconductor device assembly | Larry D. Kinsman, Walter L. Moden | 2005-11-08 |
| 6960373 | Continuous mode solder jet method | — | 2005-11-01 |
| 6955783 | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length | — | 2005-10-18 |
| 6953995 | Hermetic chip in wafer form | Salman Akram, Alan G. Wood | 2005-10-11 |
| 6952054 | Semiconductor package having interconnect with conductive members | Salman Akram, Alan G. Wood | 2005-10-04 |
| 6952744 | Computer including optical interconnect, memory unit, and method of assembling a computer | Alan G. Wood | 2005-10-04 |
| 6951779 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2005-10-04 |
| 6939744 | Use of palladium in IC manufacturing with conductive polymer bump | Salman Akram | 2005-09-06 |
| 6914198 | Electrical device allowing for increased device densities | Salman Akram, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2005-07-05 |
| 6911173 | Methods for stereolithographic processing of components and assemblies | — | 2005-06-28 |
| 6911355 | Semiconductor package having flex circuit with external contacts | Alan G. Wood, Mike Brooks | 2005-06-28 |
| 6909929 | Stereolithographic method and apparatus for packaging electronic components | Mark S. Johnson | 2005-06-21 |
| 6908784 | Method for fabricating encapsulated semiconductor components | Alan G. Wood, Trung T. Doan | 2005-06-21 |
| 6909055 | Electrical device allowing for increased device densities | Salman Akram, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2005-06-21 |