Issued Patents All Time
Showing 151–175 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7253390 | Methods for packaging microelectronic imagers | Sidney B. Rigg, David R. Hembree, William M. Hiatt | 2007-08-07 |
| 7250780 | Probe card for semiconductor wafers having mounting plate and socket | David R. Hembree, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2007-07-31 |
| 7239933 | Substrate supports for use with programmable material consolidation apparatus and systems | William M. Hiatt, David R. Hembree, Peter Benson | 2007-07-03 |
| 7239932 | Methods and apparatus for calibrating programmable material consolidation apparatus | — | 2007-07-03 |
| 7235431 | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material | Alan G. Wood, Charles M. Watkins, Peter Benson | 2007-06-26 |
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, William M. Hiatt | 2007-06-19 |
| 7232747 | Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation | Jerry M. Brooks | 2007-06-19 |
| 7227261 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2007-06-05 |
| 7225044 | Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques | William M. Hiatt, David R. Hembree, Peter Benson | 2007-05-29 |
| 7224051 | Semiconductor component having plate and stacked dice | Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2007-05-29 |
| 7223626 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Alan G. Wood, James M. Wark, David R. Hembree, Rickie C. Lake | 2007-05-29 |
| 7221059 | Wafer level semiconductor component having thinned, encapsulated dice and polymer dam | Alan G. Wood, Trung T. Doan | 2007-05-22 |
| 7216009 | Machine vision systems for use with programmable material consolidation system and associated methods and structures | Alan G. Wood | 2007-05-08 |
| 7214962 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2007-05-08 |
| 7212020 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugen H. Cloud | 2007-05-01 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson, James M. Wark +4 more | 2007-04-03 |
| 7192311 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2007-03-20 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2007-03-13 |
| 7183194 | Method of forming socket contacts | — | 2007-02-27 |
| 7183133 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, William M. Hiatt, Nishant Sinha | 2007-02-27 |
| 7170361 | Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices | — | 2007-01-30 |
| 7165322 | Process of forming socket contacts | Salman Akram | 2007-01-23 |
| 7159752 | Continuous mode solder jet apparatus | — | 2007-01-09 |
| 7157353 | Method for fabricating encapsulated semiconductor components | Alan G. Wood, Trung T. Doan | 2007-01-02 |
| 7153164 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2006-12-26 |