Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10745589 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | Xiaobo Shi, Joseph D. Rose, Timothy Joseph Clore, James Allen Schlueter, Mark Leonard O'Neill | 2020-08-18 |
| 10669449 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Xiaobo Shi, Krishna P. Murella, Steven Charles Winchester +5 more | 2020-06-02 |
| 10109493 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Xiaobo Shi, Krishna P. Murella, Steven Charles Winchester +5 more | 2018-10-23 |
| 9978609 | Low dishing copper chemical mechanical planarization | Xiaobo Shi, James Allen Schlueter, Joseph D. Rose, Mark Leonard O'Neill | 2018-05-22 |
| 9431312 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben | 2016-08-30 |
| 9318400 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben | 2016-04-19 |
| 8666505 | Wafer-scale package including power source | Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben | 2014-03-04 |
| 7330036 | Engagement Probes | Warren M. Farnworth | 2008-02-12 |
| 7116118 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Warren M. Farnworth, Gurtej S. Sandhu | 2006-10-03 |
| 7098475 | Apparatuses configured to engage a conductive pad | Warren M. Farnworth, Gurtej S. Sandhu | 2006-08-29 |
| 7026835 | Engagement probe having a grouping of projecting apexes for engaging a conductive pad | Warren M. Farnworth, Gurtej S. Sandhu | 2006-04-11 |
| 6960115 | Multiprobe detection system for chemical-mechanical planarization tool | Matthew Weldon, Thomas Laursen, Paul Holzapfel, Mark Meloni, Robert A. Eaton | 2005-11-01 |
| 6833727 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Warren M. Farnworth, Gurtej S. Sandhu | 2004-12-21 |
| 6805613 | Multiprobe detection system for chemical-mechanical planarization tool | Matthew Weldon, Thomas Laursen, Paul Holzapfel, Mark Meloni, Robert A. Eaton | 2004-10-19 |
| 6686758 | Engagement probe and apparatuses configured to engage a conductive pad | Warren M. Farnworth, Gurtej S. Sandhu | 2004-02-03 |
| 6670819 | Methods of engaging electrically conductive pads on a semiconductor substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-12-30 |
| 6657450 | Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes | Warren M. Farnworth, Gurtej S. Sandhu | 2003-12-02 |
| 6614249 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-09-02 |
| 6573740 | Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-06-03 |
| 6555466 | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers | Thomas Laursen, Krishna P. Murella, Sanjay Basak | 2003-04-29 |
| 6462571 | Engagement probes | Warren M. Farnworth, Gurtej S. Sandhu | 2002-10-08 |
| 6392426 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2002-05-21 |
| 6387188 | Pad conditioning for copper-based semiconductor wafers | Thomas Laursen, Krishna P. Murella, Sanjay Basak | 2002-05-14 |
| 6380754 | Removable electrical interconnect apparatuses including an engagement proble | Warren M. Farnworth, Gurtej S. Sandhu | 2002-04-30 |
| 6127195 | Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus | Warren M. Farnworth, Gurtej S. Sandhu | 2000-10-03 |