| 10745589 |
Chemical mechanical polishing (CMP) of cobalt-containing substrate |
Xiaobo Shi, Joseph D. Rose, Timothy Joseph Clore, James Allen Schlueter, Mark Leonard O'Neill |
2020-08-18 |
|
| 10669449 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof |
Hongjun Zhou, Jo-Ann Theresa Schwartz, Xiaobo Shi, Krishna P. Murella, Steven Charles Winchester +5 more |
2020-06-02 |
|
| 10109493 |
Composite abrasive particles for chemical mechanical planarization composition and method of use thereof |
Hongjun Zhou, Jo-Ann Theresa Schwartz, Xiaobo Shi, Krishna P. Murella, Steven Charles Winchester +5 more |
2018-10-23 |
|
| 9978609 |
Low dishing copper chemical mechanical planarization |
Xiaobo Shi, James Allen Schlueter, Joseph D. Rose, Mark Leonard O'Neill |
2018-05-22 |
|
| 9431312 |
Wafer-scale package including power source |
Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben |
2016-08-30 |
$55,927,000 |
| 9318400 |
Wafer-scale package including power source |
Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben |
2016-04-19 |
$33,708,000 |
| 8666505 |
Wafer-scale package including power source |
Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben |
2014-03-04 |
$12,729,000 |
| 7330036 |
Engagement Probes |
Warren M. Farnworth |
2008-02-12 |
$1,579,000 |
| 7116118 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
Warren M. Farnworth, Gurtej S. Sandhu |
2006-10-03 |
$1,273,000 |
| 7098475 |
Apparatuses configured to engage a conductive pad |
Warren M. Farnworth, Gurtej S. Sandhu |
2006-08-29 |
$4,599,000 |
| 7026835 |
Engagement probe having a grouping of projecting apexes for engaging a conductive pad |
Warren M. Farnworth, Gurtej S. Sandhu |
2006-04-11 |
$3,047,000 |
| 6960115 |
Multiprobe detection system for chemical-mechanical planarization tool |
Matthew Weldon, Thomas Laursen, Paul Holzapfel, Mark Meloni, Robert A. Eaton |
2005-11-01 |
|
| 6833727 |
Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
Warren M. Farnworth, Gurtej S. Sandhu |
2004-12-21 |
$2,011,000 |
| 6805613 |
Multiprobe detection system for chemical-mechanical planarization tool |
Matthew Weldon, Thomas Laursen, Paul Holzapfel, Mark Meloni, Robert A. Eaton |
2004-10-19 |
|
| 6686758 |
Engagement probe and apparatuses configured to engage a conductive pad |
Warren M. Farnworth, Gurtej S. Sandhu |
2004-02-03 |
$3,037,000 |
| 6670819 |
Methods of engaging electrically conductive pads on a semiconductor substrate |
Warren M. Farnworth, Gurtej S. Sandhu |
2003-12-30 |
$2,987,000 |
| 6657450 |
Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes |
Warren M. Farnworth, Gurtej S. Sandhu |
2003-12-02 |
$2,846,000 |
| 6614249 |
Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate |
Warren M. Farnworth, Gurtej S. Sandhu |
2003-09-02 |
$2,557,000 |
| 6573740 |
Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate |
Warren M. Farnworth, Gurtej S. Sandhu |
2003-06-03 |
$4,053,000 |
| 6555466 |
Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers |
Thomas Laursen, Krishna P. Murella, Sanjay Basak |
2003-04-29 |
|
| 6462571 |
Engagement probes |
Warren M. Farnworth, Gurtej S. Sandhu |
2002-10-08 |
$2,680,000 |
| 6392426 |
Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate |
Warren M. Farnworth, Gurtej S. Sandhu |
2002-05-21 |
$4,895,000 |
| 6387188 |
Pad conditioning for copper-based semiconductor wafers |
Thomas Laursen, Krishna P. Murella, Sanjay Basak |
2002-05-14 |
$1,484,000 |
| 6380754 |
Removable electrical interconnect apparatuses including an engagement proble |
Warren M. Farnworth, Gurtej S. Sandhu |
2002-04-30 |
$4,819,000 |
| 6127195 |
Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus |
Warren M. Farnworth, Gurtej S. Sandhu |
2000-10-03 |
$14,395,000 |
