Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234383 | Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2025-02-25 |
| 12205061 | Shared data induced quality control for a chemical mechanical planarization process | Cesar Clavero, Vid Gopal, Ryan W. Clarke, Esmeralda Yitamben, Hieu Pham +6 more | 2025-01-21 |
| 12091581 | High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2024-09-17 |
| 11718767 | Chemical mechanical planarization composition for polishing oxide materials and method of use thereof | Ming-Shih Tsai, Chia-Chien Lee, Rung-Je Yang, Anu Mallikarjunan, Chris Keh-Yeuan Li +2 more | 2023-08-08 |
| 11692110 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-07-04 |
| 11667839 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-06-06 |
| 11608451 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-03-21 |
| 11549034 | Oxide chemical mechanical planarization (CMP) polishing compositions | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-01-10 |
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Xiaobo Shi, Hongjun Zhou, Krishna P. Murella, Mark Leonard O'Neill | 2022-02-22 |
| 11180678 | Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2021-11-23 |
| 11111415 | Chemical mechanical planarization of films comprising elemental silicon | James M. Henry, Hongjun Zhou, Krishna P. Murella, Dnyanesh Chandrakant Tamboli | 2021-09-07 |
| 11078417 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2021-08-03 |
| 11072726 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2021-07-27 |
| 10745589 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | Xiaobo Shi, Timothy Joseph Clore, James Allen Schlueter, Malcolm Grief, Mark Leonard O'Neill | 2020-08-18 |
| 9978609 | Low dishing copper chemical mechanical planarization | Xiaobo Shi, James Allen Schlueter, Mark Leonard O'Neill, Malcolm Grief | 2018-05-22 |
| 6513964 | Mass balance proportioner | James W. Himmelright | 2003-02-04 |