Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643599 | Tungsten chemical mechanical polishing for reduced oxide erosion | Chun Lu, Xiaobo Shi, Reinaldo Mario Machado, Mark Leonard O'Neill, Matthias Stender | 2023-05-09 |
| 11560533 | Post chemical mechanical planarization (CMP) cleaning | — | 2023-01-24 |
| 11111415 | Chemical mechanical planarization of films comprising elemental silicon | James M. Henry, Hongjun Zhou, Krishna P. Murella, Joseph D. Rose | 2021-09-07 |
| 10894906 | Composite particles, method of refining and use thereof | Hongjun Zhou, John Edward Quincy Hughes, Krishna P. Murella, Reinaldo Mario Machado, Mark Leonard O'Neill | 2021-01-19 |
| 10669449 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Xiaobo Shi, Krishna P. Murella +5 more | 2020-06-02 |
| 10421890 | Composite particles, method of refining and use thereof | Hongjun Zhou, John Edward Quincy Hughes, Krishna P. Murella, Reinaldo Mario Machado, Mark Leonard O'Neill | 2019-09-24 |
| 10418247 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Krishna P. Murella, Hongjun Zhou | 2019-09-17 |
| 10373842 | Composition and method used for chemical mechanical planarization of metals | Song-Yuan Chang, Mark Evans, Stephen W. Hymes | 2019-08-06 |
| 10253216 | Additives for barrier chemical mechanical planarization | Matthias Stender, Maitland Gary Graham, Xiaobo Shi | 2019-04-09 |
| 10109493 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Xiaobo Shi, Krishna P. Murella +5 more | 2018-10-23 |
| 10032644 | Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives | Xiaobo Shi, James Allen Schlueter, Mark Leonard O'Neill | 2018-07-24 |
| 9328318 | Method for wafer dicing and composition useful thereof | Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris | 2016-05-03 |
| 8883701 | Method for wafer dicing and composition useful thereof | Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris | 2014-11-11 |
| 8765653 | Formulations and method for post-CMP cleaning | Madhukar Bhaskara Rao, Gautam Banerjee, Keith Fabregas | 2014-07-01 |
| 8580656 | Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor | Terence Collier, Charles A. Lhota, David Barry Rennie, Rajkumar Ramamurthi, Madhukar Bhaskara Rao | 2013-11-12 |
| 7977121 | Method and composition for restoring dielectric properties of porous dielectric materials | Madhukar Bhaskara Rao, Mark Leonard O'Neill | 2011-07-12 |
| 6972083 | Electrochemical method and system for monitoring hydrogen peroxide concentration in slurries | Vimalkur Haribhai Desai | 2005-12-06 |